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Automated X-ray Inspection (AXI)
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TR7600XLL SII
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TR7600XLL SII
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INTRODUCTION
TR7600XLL SII is high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XLL SII systems uses TRI's unique shadow-free technology to inspect multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs and Press-fit connectors. Smart programming assistants and multi-resolution programs help maximize production yields on any production line.
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• Very Large board edge to edge inspection up to 1000 mm x 660 mm
• Automated programming saves hours of engineer workload
• Multi resolution programs and advanced processing for superior image quality
• Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
• X-ray tube with adjustable output up to 130 kV/300 µA
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
High-performance, ultra-sensitive bidirectional line-scan cameras |
X-ray Source |
Microfocus tube 130 kV max (user adjustable) |
Imaging Resolution |
7 μm, 10 μm, 15 μm, 20 μm (3 settings factory configured) |
Inspection Method |
2.5D, 3D Slicing, Planar CT (optional) |
Motion Table & Control
X-Axis Control |
High-precision ballscrew + AC-servo controller |
Y-Axis Control |
High-precision ballscrew + AC-servo controller |
Z-Axis Control |
High-precision ballscrew + AC-servo controller |
X-Y Axis Resolution |
1 µm |
Board Handling
Max PCB Size |
1000 x 660 mm
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PCB Thickness |
0.6-7 mm
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Max PCB Weight |
12 kg [15 kg optional]
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Top Clearance |
@ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm: 15 mm @ 7 μm: 7 mm
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Bottom Clearance |
70 mm |
Edge Clearance |
3 mm or 5 mm |
Conveyor Height |
880 - 920 mm
* SMEMA Compatible
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Inspection Functions
Component |
Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating
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Solder |
Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead
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Dimensions
WxDxH |
1750 x 2140 x 1945 mm
Note: not including signal tower, height: 510 mm
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Weight |
4500 kg
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Power Requirement |
200 - 240 VAC three phase, 50/60 Hz, 7 kVA (346-416 VAC optional three phase transformer)
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