Automated Optical Inspection (AOI)
INTRODUCTION
The TR7700Q 3D AOI combines the latest of 2D and 3D technologies based on digital quad fringe pattern projection to revolutionize PCB assembly inspection. The versatile programmable 3D digital fringe pattern technology covers a huge inspection range with great accuracy, revealing even the smallest coplanarity defects and solder joint issues.Ensure the quality of solder joints using IPC-compliant 3D solder filet inspection. By checking the filet shape, the TR7700QI 3D AOI can detect insufficient solder volume, non-wetting and dry pads.
• Ultra-high Precision 2D+3D Stop-and-Go AOI
• Solder Height and Volume Inspection
• Accurate Quad 3D Digital Fringe Projection
• Adaptive 3D height Range up to 30 mm
• Air-free Intelligent Conveyor System (IACS)
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Stop-and-Go Imaging
Top Camera
4 Mpix or 12 Mpix (factory setting)
Angle Camera
N/A
Imaging Resolution
5.5 µm, 10 µm, 15 µm (factory setting)
Lighting
Multi-phase True Color LED
3D Technology
Quad Digital Fringe Projectors
Max. 3D Range
4 Mpix@ 15 µm: 0-30 mm* 12 Mpix@ 5.5 µm: 0-4 mm 12 Mpix@ 10 µm: 0-30 mm* *Need GPU card upgrade
Inspection Performance
Imaging Speed
4 Mpix@ 15 µm: 21 cm²/sec 12 Mpix@ 5.5 µm: 4.3 cm²/sec (2D only: 12.2 cm²/sec) 12 Mpix@ 10 µm: 14.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress Note: Depending on component distribution
Motion Table & Control
X-Axis Control
Ballscrew + AC-servo controller
Y-Axis Control
Ballscrew + AC-servo controller
Z-Axis Control
Ballscrew + AC-servo controller
X-Y Axis Resolution
1 μm
Board Handling
Max PCB Size
TR7700Q @ 5.5 µm: 330 x 330 mm* TR7700Q @ 10 µm, 15 µm: 510 x 460 mm TR7700Q DL @ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane *Depending on component distribution, the vailable PCB size could be different
PCB Thickness
0.6-5 mm
Max PCB Weight
3 kg
Top Clearance
5.5 µm: 25 mm 10 µm: 50 mm 15 µm: 40 mm
Bottom Clearance
40 mm [100 mm optional]
Edge Clearance
3 mm [5 mm optional]
Conveyor
Inline Height: 880 – 920 mm * SMEMA Compatible
Inspection Functions
Component
Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder
Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination
Dimensions
WxDxH
TR7700Q: 1000 x 1400 x 1650 mm TR7700Q DL: 1000 x 15000 x 1650 mm Note: not including signal tower, signal tower height 520 mm
Weight
TR7700Q: 650 kg TR7700Q DL: 685 kg
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement