We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
The currently displayed page is not available in the selected language. Select Yes to go to =A= version, No to go to =B= version, or click the X symbol to stay on this page.
  • =A=
  • =B=
About Us Solutions News Customer Service Investor Relations

Solutions

Semiconductor Inspection (SEMI)

TR7007 SII Ultra

INTRODUCTION

The TR7007 SII Ultra is the latest High Resolution 6 μm platform for SEMI Back-end Solder Inspection. The 3D SEMI SPI has metrology capabilities for solder measurements, such as solder gaps. The platform is also equipped with wide spectrum light to enhance contrast and increase defect detection rate. The TR7007 SII Ultra is an Industry 4.0 Ready Solution that supports closed loop feedback / feed-forward, the IPC-CFX, and the IPC Hermes 9852 standard.

Applications: Bumps, Flux, Glue, Solder Paste, Surface


•  High-speed SEMI Back-end inspection, up to 74 cm2/sec
•  Precise Solder Measurements with TRI SPI Metrology
•  Wide Spectrum Light for Enhanced Contrast and Detection Rate
•  Ready to Inspect in Minutes with TRI's Smart Programming
•  Closed Loop Ready: Feedback and Feed-forward Capabilities
•  Smart Factory solution with Real-time SPC Trends