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Semiconductor Inspection (SEMI)



The TR7900Q SII-R is the 3D Automated Inspection and Rejection Station for the Semiconductor & Advanced Packaging Industry. The 3D SEMI AOI fully integrates with the loader/unloader module to ease handling strips and magazines. The 2.5 μm high-resolution platform can inspect die bonding, ball bonding, ribbon bond, wedge bond, epoxy, SiP, underfill, SMD, bumps, and solder joints. The Smart Factory AOI solution can inspect up to 15 μm (0.6 mil) wire diameters.
• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• Inking module for Reject Identification
• 2.5 μm High-Resolution 3D AOI with Metrology-grade* measurements capabilities
• Built-in Loader and Unloader for Magazine handling
• Powered by AI Algorithms for Wire Detection*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*
• Clean Room Class 100 - ISO Class 5 (ISO 14644-1)

*Optional Modules