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Semiconductor Inspection (SEMI)



The TR7720S is an AI-powered Small Form AOI for the Semiconductor & Packaging industry Inspection of wire bonding, die bonding, SMD, and solder joints. Enhanced with Metrology measurements and a robust mechanical structure, the TR7720S offers precise and accurate results. The 5.5 μm High-Resolution AOI solution can inspect up to 50 μm (2 mil) wire diameters.
• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• 5.5 μm High-Resolution Small Form Factor AOI
• AI-Powered Inspection Algorithms for Wire Detection*
• Metrology-grade measurements* improving data traceability
• Inspection of Au, Al, Ag, and Cu Wires down to 50 μm Dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Smart Factory Ready – Real-Time SPC Trends

*Optional Modules