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Semiconductor Inspection (SEMI)



The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.

• Semiconductor and Packaging technology Inspection
• Ultra-High Precision Stop-and-Go 3D AOI
• Inspection of Wire Bonding and Die Bonding Defects
• Ready to Inspect in Minutes with TRI's Smart Programming