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Automated Optical Inspection (AOI)

TR7700Q

INTRODUCTION

The TR7700Q 3D AOI combines the latest of 2D and 3D technologies based on digital quad fringe pattern projection to revolutionize PCB assembly inspection. The versatile programmable 3D digital fringe pattern technology covers a huge inspection range with great accuracy, revealing even the smallest coplanarity defects and solder joint issues.Ensure the quality of solder joints using IPC-compliant 3D solder filet inspection. By checking the filet shape, the TR7700QI 3D AOI can detect insufficient solder volume, non-wetting and dry pads.

• Ultra-high Precision 2D+3D Stop-and-Go AOI
• Solder Height and Volume Inspection
• Accurate Quad 3D Digital Fringe Projection
• Adaptive 3D height Range up to 30 mm
• Air-free Intelligent Conveyor System (IACS)

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	4 Mpix or 12 Mpix (factory setting)
Angle Camera	N/A
Imaging Resolution	5.5 µm, 10 µm, 15 µm (factory setting)
Lighting	Multi-phase True Color LED
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	4 Mpix@ 15 µm: 0-30 mm* 12 Mpix@ 5.5 µm: 0-4 mm 12 Mpix@ 10 µm: 0-30 mm* *Need GPU card upgrade

Inspection Performance

Imaging Speed

4 Mpix@ 15 µm: 21 cm²/sec
12 Mpix@ 5.5 µm: 4.3 cm²/sec (2D only: 12.2 cm²/sec)
12 Mpix@ 10 µm: 14.5 cm²/sec
12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress

Note: Depending on component distribution

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	Ballscrew + AC-servo controller
X-Y Axis Resolution	1 μm

Board Handling

Max PCB Size	TR7700Q @ 5.5 µm: 330 x 330 mm* TR7700Q @ 10 µm, 15 µm: 510 x 460 mm TR7700Q DL @ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane *Depending on component distribution, the vailable PCB size could be different
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	5.5 µm: 25 mm 10 µm: 50 mm 15 µm: 40 mm
Bottom Clearance	40 mm [100 mm optional]
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700Q: 1000 x 1400 x 1650 mm TR7700Q DL: 1000 x 15000 x 1650 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700Q: 650 kg TR7700Q DL: 685 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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