Solutions

Automated Optical Inspection (AOI)

TR7700QE-S

INTRODUCTION

The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.

• Semiconductor and Packaging technology Inspection
• Ultra-High Precision Stop-and-Go 3D AOI
• Inspection of Wire Bonding and Die Bonding Defects
• Ready to Inspect in Minutes with TRI's Smart Programming

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Angle Camera	N/A
Imaging Resolution	5.5 µm
Lighting	Multi-phase true color LED
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	12 Mpix@ 5.5 µm: 4 mm

Inspection Performance

Imaging Speed

12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec
12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec

Note: Depending on component distribution

Motion Table & Control

X-Axis Control	Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional)
Y-Axis Control	Dual driven ballscrew + AC-servo with Motion Controller
Z-Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	330 x330 mm* *Depending on component distribution, the vailable PCB size could be different
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm. Optional: 100 mm
Edge Clearance	3 mm. Optional: 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm
Weight	920 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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