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3D Solder Paste Inspection (SPI)
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TR7007D/DI Plus
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TR7007D Plus
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INTRODUCTION
The TR7007D/DI Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007D/DI Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/DI Plus is equipped with two projectors to ensure seamless shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
• Enhanced 2D Lighting, for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends.
• Closed Loop Ready: Feedback and Feedforward Capabilities.
Optical System
| Imaging Method |
Stop-and-Go Imaging |
| Camera |
4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution |
5.5 μm, 6 μm, 10 μm , 15 µm (factory setting) |
| Lighting |
Enhanced 2D Lights (RGB+W) |
| 3D Technology |
2-way Digital Fringe Pattern |
| Field of View |
4 MP Camera Link-
@ 10 μm: 20.3x20.3 mm
@ 15 μm: 30.5x30.5 mm
12 MP Camera Link-
@ 5.5 μm: 22.5x16.5 mm
@ 10 μm: 40.6x30.7 mm
@ 15 μm: 61x46 mm
12 MP CoaXPress-
@ 6 μm: 24.3x18.4 mm
@ 10 μm: 40.6x30.7 mm
@ 15 μm: 61x46 mm |
Inspection Performance
| Imaging Speed |
4 MP Camera Link: Up to 3 FOV/sec
12 MP Camera Link: Up to 1.8 FOV/sec
12 MP CoaXPress: Up to 2.6 FOV/sec |
| Height Resolution |
@10 μm/15 μm: 0.45 μm
@5.5 μm/6 μm: 0.22 μm |
| Max. Solder Height |
@10 μm/15 μm: 420 μm/750 μm
@5.5 μm/6 μm: 210 μm/310 μm
* on Calibration Target |
Motion Table & Control
| X-Axis Control |
Ballscrew + EtherCAT motion controller |
| Y-Axis Control |
Ballscrew + EtherCAT motion controller |
| Z-Axis Control |
Ballscrew + EtherCAT motion controller |
| X-Y Axis Resolution |
0.5 μm |
| Z-Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7007D/DI Plus:@5.5 μm, 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm
TR7007D/DI Plus DL:@10 μm, 15 μm - 510x310 mm x 2 Lanes, 510x590 mm x 1 Lane
TR7007LD Plus:@6 μm, 10 μm, 15 μm - 765 x 610 mm |
| PCB Thickness |
0.6 - 5mm |
| Max PCB Weight |
3kg. Optional: 5kg |
| Top Clearance |
@5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm |
| Conveyor Height |
880 – 920 mm
* SMEMA Compatible
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Inspection Functions
| Defects |
Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging |
| Measurement |
Height
Area
Volume
Offset |
Dimensions
| WxDxH |
TR7007D Plus: 1000 x 1400 x 1650 mm
TR7007D Plus DL: 1000 x 1500 x 1650 mm
TR7007LD Plus: 1365 x 1720 x 1710 mm
TR7007DI Plus: 1000 x 1360 x 1600 mm
TR7007DI Plus DL: 1000 x 1717 x 1600 mm
Note: not including signal tower, signal tower height 515 mm |
| Weight |
TR7007D Plus: 775 kg
TR7007D Plus DL: 825 kg
TR7007LD Plus: 982 kg
TR7007DI Plus: 775 kg
TR7007DI Plus DL: 825 kg
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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