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3D Solder Paste Inspection (SPI)

TR7007D/DI Plus

TR7007D Plus
  • TR7007D Plus
  • TR7007DI Plus
TR7007D Plus


The TR7007D/DI Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007D/DI Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/DI Plus is equipped with two projectors to ensure seamless shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
•  Enhanced 2D Lighting, for higher uniformity inspection.
•  New motion controller, EtherCAT, for real-time measurements.
•  Smart Factory solution with Real-time SPC Trends.
•  Closed Loop Ready: Feedback and Feedforward Capabilities.