We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
The currently displayed page is not available in the selected language. Select Yes to go to =A= version, No to go to =B= version, or click the X symbol to stay on this page.
  • =A=
  • =B=


3D Solder Paste Inspection (SPI)

TR7007Q Plus


The TR7007Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007Q Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007Q Plus is equipped with up to 4 projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
• Enhanced 2D Lighting, for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends
• Closed Loop Ready: Feedback and Feedforward Capabilities