솔루션

자동 광학 검사(AOI)

TR7700 SIII 3D


TR7700 SIII 3D

INTRODUCTION

TRI의 획기적인 3D AOI 솔루션은 가장 빠른 하이브리드 PCB 검사를 제공합니다. 광학 및 블루 레이저 기반 트루 3D 측면 측정 기능으로 가능한 한 최고로 넓은 범위에서 자동 결함 징후를 찾아냅니다. 내장된 최첨단 소프트웨어 솔루션과 3세대 지능형 하드웨어 플랫폼 덕분에 안정적이고 강력하게 3D 솔더 및 구성품 결함 검사를 수행할 수 있으며 검사 범위가 넓고 프로그래밍이 쉽습니다.

• 최대 01005 구성품의 2D + 3D 고속 검사
• 하이브리드 2D + 3D 검사 기술을 사용한 높은 결함 감지율
• 듀얼 레이저 장치를 사용한 트루 3D 측면 측정
• 자동 라이브러리 및 오프라인 편집 기능이 포함된 지능형 신속 프로그래밍 인터페이스

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Dynamic Imaging with true 3D profile measurement
Top Camera	4 Mpix
Angle Camera	N/A
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	Single/Dual 3D laser sensors
Max. 3D Range	20 mm

Inspection Performance

Imaging Speed

4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

* Depending on board size and laser resolution

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	N/A
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1630 x 1655 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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