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INTRODUCTION
TR7900Q SII는 반도체 및 첨단 패키징 산업에 적합한 2.5μm 초고해상도와 25MP 이미징 기술을 갖추었습니다. AI 기반 알고리즘 및 측정 기능은 스마트 3D AOI 솔루션의 효율성을 극대화시킵니다. 3D SEMI AOI는 로더/언로더와 연동하여 스트립 및 매거진을 쉽게 다룰 수 있습니다. Stop-and-Go 3D AOI는 다이 본딩, 볼 본딩, 리본 본드, 웨지 본드, SiP, 언더필, SMD, 범프 및 솔더 조인트를 검사할 수 있습니다. 스마트 팩토리 AOI 솔루션은 와이어 직경을 최대 15μm(0.6m)까지 검사할 수 있습니다.
• 와이어 본딩 및 다이 본딩을 위한 첨단 패키지 불량 검사
• 2.5μm의 Metrology-grade* 측정 기능을 갖춘 고해상도 3D AOI
• 매거진 핸들링을 위한 로더 및 언로더 연동
• AI알고리즘을 기반으로 한 와이어 불량 검출
• Au, Al, Ag, Cu 와이어를 15 μm까지 검사
• 본드 검사: 볼 본드, 웨지 본드 및 리본 본드
• SWIR(Shortwave Infrared) 조명으로 내부 cracks and chipping* 감지
• Clean Room Class 1000 - ISO Class 6 (ISO 14644-1)
*옵션 모듈
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Top Camera |
25 Mpix |
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Imaging Resolution |
2.5 µm |
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Lighting |
Multi-phase True Color LED |
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3D Technology |
Quad Digital Fringe Projectors |
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Max. 3D Height Range |
15 mm |
Motion Table & Control
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X Axis Control |
Ball Screw + AC Servo Motor or Linear Motor |
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Y Axis Control |
Dual Ball Screw + AC Servo Motor or Dual Linear Motor (Optional) |
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Z Axis Control |
Ball Screw + AC Servo Motor (Reducer Optional) |
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X-Y Axis Resolution |
0.1 µm |
Board Handling
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Max. Stack Magazine Qty. |
3 Magazines (based on Magazine width 125 mm) |
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Magazine Dimension |
Width: 50 - 175 mm
Length: 120 - 320 mm
Height: 80 - 150 mm
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Strip Dimension |
Width *: 35 - 150 mm
Length: 100 - 285 mm
Thickness: 0.1 - 1.5 mm
* When the strip width is between 35-54 mm, will require a special design.
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Max. Strip Weight |
0.5 kg |
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Strip Carrier / Fixing |
Belt Conveyor |
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Top Clearance |
7 mm |
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Bottom Clearance |
10 mm |
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Edge Clearance |
3 mm |
Inspection Functions
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Die Bonding |
Missing
Orientation
Rotation
Shift
Tilted
Chipping
Crack
Scratch
Foreign Material
Bond line thickness
Epoxy on Die
Epoxy Coverage
Epoxy Height
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Wire Bonding |
Broken
Short
Sweep/Sink
Missing
Sway
Collapse
Loop Height
Sagged Wire
Cross Wire Gap
Wire Tracing
Ball Bond Diameter
Ball Placement
Stitch Width
Stitch Coverage over Ball
Ball-off Pad
Ball touch Pad Distance
Clubbed Ball
Ball Thickness
Lifted Ball
Low Landing
Bond on Contamination
Foreign Material
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Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
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Dimensions
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WxDxH |
990 x 1495 x 1700 mm (Without Auto Load/Unload Module)
2065 x 1490 x 1700 mm (With Auto Load/Unload Module)
Note: not including signal tower, signal tower height 515 mm |
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Weight |
823 kg. With Auto Load/Unload Module: 989.5 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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검색
회원 영역
