솔루션

3D 솔더 페이스트 검사(SPI)

TR7007 SII Ultra

INTRODUCTION

The TR7007 SII Ultra는 최대 180 cm2/sec 검사 속도로 업계 선두에 위치해 있습니다. The TR7007 SII Ultra는 검사 중에 안정성, 정확성 및 정밀도를 보장하기 위해 더욱 향상된 기계식 플랫폼을 기반으로합니다. 3D SPI는 IPC CFX (Connected Factory Exchange) 및 IPC Hermes 9852 표준과 같은 향후 혁신적인 프로토콜을 지원하는 Industry 4.0 Ready Solution 입니다.

• 최대 180cm² / sec의 업계 선두의 검사 속도
• TRI의 스마트 프로그래밍과 더불어 빠른 검사 준비
• Closed Loop 지원 : 피드백 및 피드포워드 기능을 제공
• 실시간 SPC 트렌드를 반영한 스마트 팩토리 솔루션

Optical System

Imaging Method	Dynamic Imaging
Camera	4 Mpix
Imaging Resolution	10 μm, 15 µm (factory setting)
Lighting	RGB LED
3D Technology	2-way Fringe Pattern
Field of View	4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed	4 Mpix@ 10 µm: 80 cm²/sec 4 Mpix@ 15 µm: 180 cm²/sec
Height Resolution	0.4 µm
Max. Solder Height	@ 10 µm: 420 µm @ 15 µm: 385 µm

Motion Table & Control

X-Axis Control	Linear motor + Linear Scale + EtherCAT Servo
Y-Axis Control	AC motor with ball screw + EtherCAT Servo
Z-Axis Control	AC motor with ball screw + EtherCAT Servo
X-Y Axis Resolution	0.5 µm
Z-Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7007 SII Ultra: 510 x 460 mm TR7007 SII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor Height	880 – 920 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SII Ultra: 1100 x 1480 x 1600 TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm Note: not including signal tower, signal tower height 512 mm
Weight	TR7007 SII Ultra: 740 kg TR7007 SII Ultra DL: 925 kg

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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