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TR7700L SIII
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TR7700L SIII
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INTRODUCTION
TR7700L SIII는 최신 TRI의 AOI 솔루션으로 최고 속도로 정밀한 다상 검사를 제공합니다. 초고속 카메라와 지능형 오토컨베이어, 새로운 GUI를 결합한 TR7700L SIII Plus는 빠른 프로그래밍, 최적화된 보드 로딩, 생산라인 통합 및 오프라인 프로그래밍 지원으로 강력하고 사용하기 쉬운 AOI 솔루션을 제공합니다. TRI의 새로운 컬러 알고리즘은 다상 조명과 결합하여 검출 범위를 늘리고 최소한의 가성불량으로 매우 정확한 검사 결과를 제공합니다.
• 고정밀 풀 스피드의 다상 AOI
• 새로운 GUI 오프라인 편집으로 쉬운 프로그래밍 제공
• 로드 시간 단축을 위한 지능형 자동 컨베이어
• 높은 정확도를 제공하고 오류를 최소화하는 새로운 컬러 알고리즘
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Dynamic Imaging |
| Top Camera |
4 or 9 or 12 Mpix high speed color camera |
| Angle Camera |
N/A |
| Imaging Resolution |
5.5 µm, 10 µm, 15 µm (factory setting)
Note: 4 MP camera configuration supports 10/15 μm, 12 MP configuration supports 6 μm. |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
(Optional for TR7700L SIII, TR7700L SIII Plus) |
| Max. 3D Range |
@5.5 μm: 2 mm
@10 μm: 4 mm
@15 μm: 20 mm
Note: Depending on board size, layout, laser type and/or laser module settings |
Inspection Performance
| Imaging Speed |
@5.5 μm 2D: 24 cm²/sec
@10 µm 2D: 60 cm²/sec
@15 µm 2D: 120 cm²/sec
@5.5 µm 2D+3D (optional): 4 – 10 cm²/s
@10 µm 2D+3D (optional): 27 – 39 cm²/sec
@15 µm 2D+3D (optional): 40 – 60 cm²/sec
Note: Depending on board size, layout, laser type and/or laser module settings
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Motion Table & Control
| X-Axis Control |
Ballscrew + AC-servo controller |
| Y-Axis Control |
Ballscrew + AC-servo controller |
| Z-Axis Control |
N/A |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7700L SIII: 660 x 610 mm
TR7700L SIII 3D: 660 x 460 mm
TR7700L SIII Plus: 765 x 610 mm |
| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
TR7700L SIII: 5 kg
TR7700L SIII 3D: 3 kg
TR7700L SIII Plus: 3 kg. Optional: 5 / 12 kg |
| Top Clearance |
25 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
TR7700L SIII: 5 mm
TR7700L SIII 3D: 3 mm. [5 mm optional]
TR7700L SIII Plus: 3 mm. [4 / 5 mm optional] |
| Conveyor |
Inline
Height: 880 – 920 mm
* SMEMA Compatible
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Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
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| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
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Dimensions
| WxDxH |
TR7700L SIII (3D): 1300 x 1530 x 1650 mm
TR7700L SIII Plus: 1365 x 1720 x 1710 mm
Note: not including signal tower, signal tower height 520 mm |
| Weight |
TR7700L SIII: 1240 kg
TR7700L SIII 3D: 1250 kg
TR7700L SIII Plus: 1005 kg |
Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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검색
회원 영역
