솔루션

ICT(In-Circuit Tester, 회로판 테스트 장비)

TINY SII INLINE


TINY SII INLINE

INTRODUCTION

TINY SII INLINE은 초소형 기판의 ICT 테스트용으로 설계되어, 최대 640개 테스트 지점을 지원하는 비용 효율적이며 유연한 자동 테스트 플랫폼입니다. 이 완전 전자식 SMEMA 호환 플랫폼은 차지하는 공간이 극히 작으며, TR5001T SII TINY ICT의 기능은 모두 그대로 갖고 있습니다.

• 완전한 기능을 갖춘 인라인 테스트 플랫폼
• TRI TR5001T SII TINY ICT 테스트 장비용으로 설계
• SMEMA 통합으로 극히 적은 공간 차지
• 압축 공기 없이 전체 전기 설계
• 최대 640개 MDA 아날로그 테스트 지점

Tester Specifications

Analog/hybrid test points	640 analog test points
Operating System	Microsoft^® Windows compatible PC with USB, Windows 10
Fixture Type	Inline/Manual Insertion

Standard Testing Components

Analog Test Hardware

• 6-wire measurement switching matrix
• Measures voltage, current and frequency
• Component R/L/C/D measurement
• 60 V high voltage current source for LED strip testing

Optional Components

Analog Hardware	• TestJet vectorless open circuit detection • Sine Wave Generator
Digital Testing	• Boundary Scan • Data Acquisition and Audio analyzer modules • Enhanced Digital Test Module
Yield Management System	YMS 4.0

Board Handling

Min PCB Size	70 x 70 mm
Max PCB Size	330 x 250 mm
PCB Thickness	0.6 - 5 mm

Dimensions

WxDxH	600 x 936 x 1800 mm Note: not including signal tower, height: 295 mm
Weight	340 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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