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ICT(In-Circuit Tester, 회로판 테스트 장비)
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INTRODUCTION
차세대ICT+FCT 솔루션은 높은 처리량을 위해 최대 4개의 독립적 코어를 이용하여 획기적인 성능의 멀티 코어 병렬 테스트를 제공합니다. 향상된 측정 정확도를 제공하는 TR5001Q/D SII의 새로운 자동 교정 및 자가 진단 시스템은 장기간 테스트 신뢰성을 보장합니다.
• 차세대 멀티 코어 병렬 테스터
• 모든 핀 최대 8포트 최첨단 테스트 컨트롤러 시리즈
• 제한된 접근 솔루션으로 PXI 모듈을 이용한 기능적인 테스트 확장
• 자가 진단과 자동 교정 기능 탑재
• 은 정확성의 측정/검사
• 플로우 기반의 쉬운 프로그램 개발과 직접적인 UI
Tester Specifications
Analog/hybrid test points |
TR5001Q SII: 4096
TR5001D SII: 3328
TR5001 SII: 3456 |
Operating System |
Microsoft® Windows compatible PC with USB, Windows 7-10 |
Fixture Type |
Offline press type fixture |
Standard Testing Components
Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement
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Component R/L/C measurement
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Optional Components
Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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Serial Test Controller (STC) Programming
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DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
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DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
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Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
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Yield Management System |
YMS 4.0 |
Dimensions
WxDxH |
1050 x 850 x 1735 mm |
Weight |
300 kg |
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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