Soluções

Inspeção óptica automatizada (AOI)

TR7700 SIII 3D


TR7700 SIII 3D

INTRODUCTION

A novíssima solução de AOI 3D da TRI oferece a inspeção PCB híbrida mais rápida que combina medição de perfil verdadeiro 3D baseado em laser óptico azul e para a a maior cobertura de sintoma de defeito automatizada possível. Solução integrada de software e plataforma de hardware de terceira geração inteligente oferece estável e robusta inspeção de solda 3D e de defeitos de componentes e alta cobertura de inspeção e programação fácil.

• Alta velocidade de Inspeção 2D + 3D até de componentes 01005
• Alta Cobertura de Defeito Usando Tecnologia de Inspeção Híbrida 2D + 3D
• Medição de perfil verdadeiro 3D usando unidades duplas de laser
• Interface inteligente de programação rápida com biblioteca automática e edição offline

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Dynamic Imaging with true 3D profile measurement
Top Camera	4 Mpix
Angle Camera	N/A
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	Single/Dual 3D laser sensors
Max. 3D Range	20 mm

Inspection Performance

Imaging Speed

4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

* Depending on board size and laser resolution

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	N/A
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm [5 mm optional]
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1630 x 1655 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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