|
|
Inspeção de pasta de solda 3D (SPI)
|
TR7007D/DI Plus
 |
|
|
|
TR7007D Plus
|
|
|
INTRODUCTION
A plataforma TR7007D/DI Plus 3D SPI está equipada com um controlador de movimento aprimorado (EtherCat) e um novo módulo de iluminação 2D. O TR7007D/DI Plus pode inspecionar com precisão defeitos como "pontes" ou curtos na pasta de solda e compensar o empenamento da placa para eliminar o empenamento do PCB local. O TR7007D/DI Plus está equipado com 2 projetores para inspeção sem sombras. A solução SPI facilita a troca de dados entre a linha de produção e o MES de sua escolha para permitir a rastreabilidade dos dados.
• Iluminação 2D aprimorada para inspeção mais uniforme
• Novo controlador de movimento, EtherCat, para medições em tempo real
• Solução de fábrica inteligente com funcionalidade de circuito fechado
Optical System
| Imaging Method |
Stop-and-Go Imaging |
| Camera |
4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution |
5.5 μm, 6 μm, 10 μm, 12 μm, 15 µm (factory setting) |
| Lighting |
Enhanced 2D Lights (RGB+W) |
| 3D Technology |
2-way Digital Fringe Pattern |
| Field of View |
4 MP Camera Link-
@ 10 μm: 20.3x20.3 mm
@ 15 μm: 30.5x30.5 mm
12 MP Camera Link-
@ 5.5 μm: 22.5x16.5 mm
@ 10 μm: 40.6x30.7 mm
@ 15 μm: 61x46 mm
12 MP CoaXPress-
@ 6 μm: 24.3x18.4 mm
@ 10 μm: 40.6x30.7 mm
@ 12 μm: 48.7x36.8 mm
@ 15 μm: 61x46 mm |
Inspection Performance
| Imaging Speed |
4 MP Camera Link: Up to 3 FOV/sec
12 MP Camera Link: Up to 1.8 FOV/sec
12 MP CoaXPress: Up to 2.6 FOV/sec |
| Height Resolution |
@10 μm/15 μm: 0.45 μm
@5.5 μm/6 μm: 0.22 μm |
| Max. Solder Height |
@10 μm/15 μm: 420 μm/750 μm
@5.5 μm/6 μm: 210 μm/310 μm
* on Calibration Target |
Motion Table & Control
| X-Axis Control |
Ballscrew + EtherCAT motion controller |
| Y-Axis Control |
Ballscrew + EtherCAT motion controller |
| Z-Axis Control |
Ballscrew + EtherCAT motion controller |
| X-Y Axis Resolution |
0.1 μm |
| Z-Axis Resolution |
0.1 μm |
Board Handling
| Max PCB Size |
TR7007D/DI Plus:@5.5 μm, 6 μm - 400 x 330 mm, @10, 12, 15 μm - 510 x 460 mm
TR7007D/DI Plus DL:@10, 12, 15 μm - 510x310 mm x 2 Lanes, 510x590 mm x 1 Lane
TR7007LD Plus:@6 μm, 10 μm, 15 μm - 765 x 610 mm |
| PCB Thickness |
0.6 - 5mm |
| Max PCB Weight |
3kg. Optional: 5kg |
| Top Clearance |
@5.5 μm, 6 μm: 25 mm; @10 μm, 12 μm, 15 μm: 50 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm |
| Conveyor Height |
880 – 920 mm
* SMEMA Compatible
|
Inspection Functions
| Defects |
Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging |
| Measurement |
Height
Area
Volume
Offset |
Dimensions
| WxDxH |
TR7007D Plus: 1000 x 1400 x 1650 mm
TR7007D Plus DL: 1000 x 1500 x 1650 mm
TR7007LD Plus: 1365 x 1720 x 1710 mm
TR7007DI Plus: 1000 x 1360 x 1600 mm
TR7007DI Plus DL: 1000 x 1717 x 1600 mm
Note: not including signal tower, signal tower height 515 mm |
| Weight |
TR7007D Plus: 775 kg
TR7007D Plus DL: 825 kg
TR7007LD Plus: 982 kg
TR7007DI Plus: 775 kg
TR7007DI Plus DL: 825 kg
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
Pesquisar
Área para membros
