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Inspeção óptica automatizada (AOI)
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INTRODUCTION
O TR7700QB SII 3D AOI oferece inspeção do lado inferior (BOT) com tecnologia de imagem 12MP de alta resolução de 15 µm, capaz de medições precisas. Esta plataforma é projetada para a inspeção de PTH, DIP ou dual package. A solução AOI facilita a troca de dados entre a linha de produção e o MES de sua escolha para permitir a rastreabilidade dos dados.
• Alta velocidade de inspeção do lado inferior, até 57 cm2/seg.
• Pronto para inspecionar em minutos com a Programação Inteligente do TRI
• Alta cobertura de defeitos em THT e DIP
• Medições precisas através resolução em inspeção
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
Stop-and-Go |
Camera |
12 MP High Speed Camera |
Angle Camera |
N/A |
Imaging Resolution |
15 μm |
Lighting |
Multi-phase True Color LED |
3D Technology |
Quad Digital Fringe Projectors |
Max. 3D Range |
20 mm |
Inspection Performance
Imaging Speed |
57 cm²/sec * Depending on component distribution |
Motion Table & Control
X-Axis Control |
Ballscrew + AC Servo with Motion Controller |
Y-Axis Control |
Ballscrew + AC Servo with Motion Controller |
Z-Axis Control |
Ballscrew + AC Servo with Motion Controller |
X-Y Axis Resolution |
1 μm with linear encoder |
Board Handling
Max PCB Size |
510 x 510 mm |
PCB Thickness |
0.6 - 6 mm |
Max PCB Weight |
3kg. Optional: 5 kg |
Top Clearance |
100 mm |
Bottom Clearance |
40 mm |
Edge Clearance |
3 mm. Optional: 5 mm |
Conveyor |
Inline Height: 830 - 870 mm
* Optional: 900 mm |
Inspection Functions
Component |
Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component, Bridge, Pin Height |
THT Defects |
Missing, Position, Soldering Defects, Pinhole, Blowhole, Pin Height,
Pin Angle, Pin Offset, Bridging, Wetting
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Solder |
Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
Dimensions
WxDxH |
1100 x 1730 x 1585 mm
Note: not including signal tower, signal tower height 515 mm |
Weight |
1030 kg |
Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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