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Inspeção óptica automatizada (AOI)
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INTRODUCTION
O TR7700QM SII é uma plataforma de alta precisão com tecnologia de imagem de 12 MP de alta resolução de 5,5 µm para a indústria de semicondutores. A AOI 3D Stop-and-Go pode inspecionar solda, wire bond, die, componentes SMD, contaminações, curtos , excesso de solda, entre outros. A solução 3D AOI atinge inspeção de alta precisão por meio de metrologia e algoritmos flexíveis.
• Inspeção automatizada para a indústria de semicondutores
• Solução de inspeção de alta precisão com resolução de 5,5 μm
• Pronto para inspecionar em minutos com a Programação Inteligente do TRI
• Várias tecnologias 3D para maior cobertura
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Stop-and-Go |
| Top Camera |
12 MP High Speed Camera |
| Angle Camera |
N/A |
| Imaging Resolution |
5.5 μm |
| Lighting |
Multi-phase True Color LED, Coaxial Lighting |
| 3D Technology |
Quad Digital Fringe Projectors |
| Max. 3D Range |
20 mm |
Inspection Performance
| Imaging Speed |
Up to 7.7 cm²/sec |
Motion Table & Control
| X-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Y-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Z-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution |
1 μm with Optional Linear Encoder |
Board Handling
| Max PCB Size |
400 x 330 mm |
| PCB Thickness |
0.6 - 5mm |
| Max PCB Weight |
3 kg |
| Top Clearance |
20 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm. Optional: 5 mm |
| Conveyor |
880 - 920 mm |
Inspection Functions
| Component |
Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component |
| Solder |
Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
Dimensions
| WxDxH |
1000 x 1460 x 1650 mm
Note: not including signal tower, signal tower height 515 mm |
| Weight |
785 kg |
Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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Pesquisar
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