Soluções

Análise de defeito de manufatura (MDA)

TR518 SII INLINE


TR518 SII INLINE

INTRODUCTION

TR518 SII INLINE é uma plataforma de testes automatizada de boa relação custo benefício, flexível, projetada para teste de MDA em placas médias, com até 2496 pontos de teste. A plataforma compatível com SMEMA totalmente elétrica apresenta uma pegada ecológica mínima e capacidade completa de TR518 SII MDA.

• Plataforma de testes em linha cheio de recursos
• Projetado para testadores TRI MDA
• Pegada ecológica mínima com integração SMEMA
• Design totalmente elétrico sem ar comprimido
• Até 2496 pontos de teste analógico

Tester Specifications

Analog Test Points	TR518 SII INLINE: 2496 analog test points TR518 SII TINY INLINE: 1024 analog test points
Operating System	Microsoft^® Windows compatible PC with USB, Windows 10
Fixture Type	Inline/Manual Insertion

Analog Testing

Analog Test Hardware

6-wire measurement switching matrix
Programmable AC/DC/DC High voltage and current sources
Component R/L/C measurement

Optional Components

Analog Hardware	TestJet vectorless open circuit detection Programmable High Voltage DC Source up to 100V / 100 mA
Yield Management System	YMS 4.0

Board Handling

Min. PCB Size	50 x 50 mm
Max. PCB Size	TR518 SII INLINE: 450 x 300 mm. Optional: 500 x 360 mm TR518 SII TINY INLINE: 330 x 250 mm
PCB Thickness	0.6 ~ 5 mm

Dimensions

WxDxH	TR518 SII INLINE: 900 x 900 x 1640 mm TR518 SII TINY INLINE: 600 x 800 x 1640 mm Note: not including signal tower, height: 392 mm
Weight	TR518 SII INLINE: 470 kg TR518 SII TINY INLINE: 320 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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