|
|
Inspeção óptica automatizada (AOI)
|
TR7700 SIII Plus
 |
|
|
|
TR7700 SIII Plus
|
|
|
INTRODUCTION
TR7700 SIII Plus faz parte da última geração de soluções AOI da TRI, oferecendo inspeção multifásica precisa em velocidade máxima. Graças à combinação de uma câmera ultrarrápida, transportador automático inteligente e nova interface de usuário, o TR7700 SIII Plus oferece uma solução AOI poderosa e fácil de usar, com programação rápida, carregamento otimizado da unidade e opção de programação offline. O novo algoritmo de cores do TRI junto com seu sistema de iluminação aumenta a cobertura de defeitos e resultados de inspeção altamente precisos com um mínimo de falsas rejeições.
• AOI multifásico de alta velocidade e alta precisão
• Pronto para inspecionar em minutos com a biblioteca de inspeção inteligente TRI
• Transportador automático inteligente para tempos de carregamento reduzidos
• Novo algoritmo de cores oferece alta precisão e minimiza a taxa de falsa falha
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
Dynamic Imaging |
| Top Camera |
4 or 9 or 12 Mpix high speed color camera |
| Angle Camera |
N/A |
| Imaging Resolution |
5.5 µm, 6 µm, 10 µm, 15 µm (factory setting)
Note: 4 MP camera configuration supports 10/15 μm, 9 MP configuration supports 10 μm, 12 MP configuration supports 6 μm. |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
Single/Dual 3D laser sensors (optional) |
| Max. 3D Range |
@5.5 μm: 2 mm
@6 μm: 2 mm
@10 μm: 4 mm
@15 μm: 20 mm
Note: Depending on board size, layout, laser type and/or laser module settings |
Inspection Performance
| Imaging Speed |
@5.5 μm 2D: 24 cm²/sec
@6 µm 2D: 30 cm²/sec
@10 µm 2D: 60 cm²/sec
@15 µm 2D: 120 cm²/sec
@5.5 µm 2D+3D (optional): 4 – 10 cm²/s
@6 µm 2D+3D (optional): 4 – 10 cm²/sec
@10 µm 2D+3D (optional): 27 – 39 cm²/sec
@15 µm 2D+3D (optional): 40 – 60 cm²/sec
Note: Depending on board size, layout, laser type and/or laser module settings
|
Motion Table & Control
| X-Axis Control |
Ballscrew + AC-servo controller |
| Y-Axis Control |
Ballscrew + AC-servo controller |
| Z-Axis Control |
N/A |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7700 SIII Plus: 510 x 460 mm
TR7700L SIII: 660 x 610 mm
TR7700L SIII Plus: 765 x 610 mm
TR7700 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
|
| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
TR7700 SIII Plus: 3 kg
TR7700L SIII: 5 kg
TR7700L SIII Plus: 3 kg. Optional: 5 / 12 kg
TR7700 SIII DL: 3 kg |
| Top Clearance |
25 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
TR7700 SIII Plus: 3 mm [5 mm optional]
TR7700L SIII: 5 mm
TR7700L SIII Plus: 3 mm. [4 / 5 mm optional]
TR7700 SIII DL: 3 mm [5 mm optional] |
| Conveyor |
Inline
Height: 880 – 920 mm
* SMEMA Compatible
|
Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
|
| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
|
Dimensions
| WxDxH |
TR7700 SIII Plus: 1100 x 1670 x 1550 mm
TR7700L SIII: 1300 x 1635 x 1655 mm
TR7700L SIII Plus: 1365 x 1720 x 1710 mm
TR7700 SIII DL: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
|
| Weight |
TR7700 SIII Plus: 1080 kg
TR7700L SIII: 1240 kg
TR7700L SIII Plus: 1005 kg
TR7700 SIII DL: 1150 kg
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
Pesquisar
Área para membros
