The TR7600F3D SII Plus is the latest 3 µm high-resolution 3D AXI, with CT capabilities, for High-Reliability industries, especially for the Advanced Packaging Industry and others. The 3D AXI is powered by state-of-the-art AI inspection algorithms for Void and open defect detection. Equipped with the next-generation 110 kV X-ray source and high-resolution detectors, it captures even the minutest defects, ensuring that you meet the highest standards of quality and reliability.

The TR7600F3D SII Plus can reliably detect defects in BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.