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INTRODUCTION
TR7600HP 是一款專為功率模組（包括 IGBT、MOSFET 及 SiC 逆變器）設計的高功率 CT AXI 系統。其 3D AXI 進階演算法能有效消除散熱片陰影與雜訊，提供清晰且準確的檢測結果。TR7600HP 配備 AI 檢測演算法、AI 氣泡檢測及 AI 驅動編程技術，可實現精確且可靠的缺陷檢測。此外，TR7600HP 支援智能工廠（Smart Factory Ready），可輕鬆串接 MES 系統以達成無縫整合。
• 適用於 IGBT、功率模組及逆變器檢測的高功率 3D CT AXI
• AI 驅動檢測演算法、AI 氣泡檢測及 AI 自動編程
• 彈性的多解析度平台：支援 7 – 30 μm 解析度
• 產線即時微調，無需中斷生產
• 支援檢測尺寸達 950 x 530 mm、重量達 12 kg 的電路板
• 智慧工廠簡易 MES 串接
• 易於維護且符合輻射安全設計
• 通訊標準：SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
|
| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
40 -180 kV |
| Imaging Resolution |
7 μm - 30 μm |
| Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-Precision Dual Driven Ball Screw + AC-Servo Controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
950 x 530 mm |
| PCB Thickness |
0.4 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 30 μm: 70 mm
@ 25 μm: 70 mm
@ 20 μm: 70 mm
@ 15 μm: 60 mm
@ 10 μm: 30 mm
@ 7 μm: 15 mm |
| Bottom Clearance |
70 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm. Optional: 940 - 965 mm |
Inspection Functions
| Capabilities |
BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs, IGBT |
| Defects |
Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity, Rotation, Insufficient/Excess Solder, Bridging, Open, Solder Ball, Non-Wetting, Void and Lifted Lead |
Dimensions
| WxDxH |
1730 x 2300 x 1980 mm
* not including signal tower, height: 519 mm |
| Weight |
5500 kg |
| Power Requirement |
200 – 240 VAC, Single Phase, 50 / 60 Hz, 4 kVA |
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