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INTRODUCTION
專為半導體、先進封裝、汽車、航太及醫療等高可靠性產業設計的 TR7600 SIII Plus，是 TRI 的高產能 3D SEMI AXI 機種。該設備支援高達 800 x 350 mm、重達 12 kg 的大尺寸載板，並具備 2 µm - 20 µm 多重解析度檢測能力，可確保快速且準確地檢測 C4 凸塊、系統級封裝（SiP）與銅柱等元件；此外，在 AI 氣泡檢測與 AI 維修站等演算法的驅動下，更能進而大幅提升缺陷檢測率。
• 高產能 3D SEMI AXI，專為滿足 OSAT 的產能需求而優化
• AI 驅動檢測演算法，可實現精確的缺陷檢測
• C4 凸塊（70 µm 至 140 µm）與銅柱檢測能力
• 彈性多重解析度平台：2 – 20 µm 生產配置
• 線上微調，無需中斷生產
• 可檢測高達 800 x 350 mm、重達 12 kg 的大尺寸載板
• 支援智慧工廠，具備 MES 串接功能
• 應用領域：先進封裝、汽車、航太、醫療
Imaging System
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Camera |
Ultra-High Speed Line-Scan CCD Cameras |
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X-ray Source |
60 - 110 kV |
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Imaging Resolution |
2 μm - 20 μm |
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Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
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X Axis Control |
High-precision ballscrew + AC-servo controller |
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Y Axis Control |
High-precision ballscrew + AC-servo controller |
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Z Axis Control |
High-precision ballscrew + AC-servo controller |
Board Handling
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Max. PCB Size |
2 μm - 3 μm: 245 x 100 mm
7 μm - 20 μm: 800 x 350 mm |
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PCB Thickness |
0.6 - 7 mm (Optional: 0.4 mm, Max. PCB Weight: 3 kg) |
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Max. PCB Weight |
12 kg |
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Top Clearance |
@ 20 μm: 50 mm
@ 15 μm: 45 mm
@ 10 μm: 29 mm
@ 7 μm: 19 mm
@ 3 μm: 5 mm
@ 2 μm: 3 mm
Note: Calibration is required for non-standard resolutions. |
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Bottom Clearance |
70 mm |
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Edge Clearance |
3 mm or 5 mm |
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Conveyor |
880 – 920 mm. (Optional: 940 - 965 mm)
* SMEMA Compatible |
Inspection Functions
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Capabilities |
BGAs
Backdrill
Barrel fill
Capacitors
Resistor
Chips
Components Under RF shields
WLCSP
DIMM Connectors
Flip-Chips
Ground Pads
Gullwing
Heat sinks
J-Leads
LED Chips
LGAs
Paladin Connector
RNET
SiP
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP
THTs |
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Defects |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Foreign Material
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Non-Wetting
Void
Lifted Lead |
Dimensions
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WxDxH |
1470 x 1971 x 1975 mm
Note: not including signal tower, height: 519 mm |
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Weight |
3870 kg |
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Power Requirement |
200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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