產品介紹

自動光學檢測機 (AOI)

TR7700 SIII Ultra


TR7700 SIII Ultra

INTRODUCTION

TR7700 SIII Ultra 是最新的高產能 AOI，基於強化的機械平臺構建，確保檢測過程中的穩定性、準確性與精密度。這款高速 AOI 符合工業 4.0 解決方案，支援即將推出的創新協定，例如 IPC-CFX、IPC-Hermes-9852 及 IPC-DPMX。　

• 業界領先的檢測速度，最高可達 120 cm²/sec
• 透過 TRI 的智能編程，可在數分鐘內完成檢測設定
• 高精度計量級量測技術
• 強化的機構設計，提升穩定性與精密度
• 支援閉環 (Closed Loop) 控制：具備反饋與前饋功能
• 具備即時 SPC 趨勢的智慧工廠解決方案

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Dynamic Imaging
Top Camera	4 MP / 9 MP / 12 MP High Speed Color Camera
Angle Camera	N/A
Imaging Resolution	5.5 µm, 6 µm , 10 µm , 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	3D Laser Sensor (Standard for 3D Models)
Max. 3D Range	N/A

Inspection Performance

Imaging Speed

4 MP@ 10 μm: up to 60 cm²/sec
4 MP@ 15 μm: up to 120 cm²/sec
9 MP@ 10 μm: up to 80 cm²/sec
12 MP@ 5.5 μm: up to 32 cm²/sec
12 MP@ 6 μm: up to 37 cm²/sec

Motion Table & Control

X-Axis Control	Ballscrew + AC Servo with Motion Controller
Y-Axis Control	Ballscrew + AC Servo with Motion Controller
Z-Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7700 SIII Ultra (3D): 510 x 460 mm TR7700M SIII Ultra: 660 x 690 mm TR7700 SIII Ultra (3D) DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg. Optional: 5 kg / 12 kg
Top Clearance	25 mm. Optional: 48 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor	Inline Height: 880 – 920 mm * Optional: 940-965 mm (SMEMA compatible)

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7700 SIII Ultra (3D): 1100 x 1720 x 1710 mm TR7700M SIII Ultra: 1250 x 1888 x 1710 mm TR7700 SIII Ultra (3D) DL: 1100 x 1820 x 1710 mm Note: Not including signal tower
Weight	TR7700 SIII Ultra (3D): 940 kg TR7700M SIII Ultra: 992 kg TR7700 SIII Ultra (3D) DL: 960 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

返回上一頁