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INTRODUCTION
TR5001E SII提供具經濟效益且可客制化的解決方案，能夠完善滿足大多數客戶的測試要求。TR5001E SII 可將 MDA 、 客製化ICT 及功能測試整合，達到減少生產線人員數量的目的；內建自動校正和自我診斷功能，可確保擁有長期測試的高度可靠性。
• 從 MDA 到 ICT 及功能測試的模組化升級選配
• 內建自我診斷和自動校正功能
• 高速、準確的測量和測試
• 快速簡易的友善程序開發介面
Tester Specifications
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Analog/hybrid test points |
TR5001E SII: 3456
TR5001E SII INLINE: 2496 |
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Operating System |
Microsoft® Windows 10 |
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Fixture Type |
Inline or Offline Press Type. Inline with Long Lifespan Quick Disconnection Interface |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement
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Component R/L/C measurement
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Optional Components
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Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies:
(1) 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
(2) Programable Power (2 CH): 0.2 – 3 V@2 A max. or 3 – 24 V@3 A max.
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DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
(3) APPS7508: 75 V max. / 8 A max. / 200 W max.
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Boundary Scan: Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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On-board Flash, EEPROM, MAC programming
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ToggleScan Test: Advanced Test Technology that Combines with BScan and Vectorless Test Functions to Detect Pin Open or Short Issues
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Yield Management System |
YMS 4.0 |
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Industry 4.0 Standards |
IPC-Hermes-9852, IPC-CFX |
Board Handling
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Max. PCB Size |
TR5001E SII: Standard- 420 x 300 mm, Optional- 600 x 350 mm
TR5001E SII INLINE: Standard- 450 x 300 mm, Optional- 500 x 360 mm |
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PCB Thickness |
0.6 - 5 mm |
Dimensions
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WxDxH |
TR5001E SII: 1000 x 900 x 1680-1700 mm
TR5001E SII INLINE: 900 x 900 x 1640 mm
Note: not including signal tower,signal tower height: 392 mm |
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Weight |
TR5001(D/Q) SII INLINE: 670 kg
TR5001(D/Q)L SII INLINE: 720 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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