產品介紹

防護塗層自動光學檢測機 (CI AOI)

TR7700 SIII Ultra CI

INTRODUCTION

TR7700 SIII Ultra CI是優化製造商生產良率和實現工廠自動化的強大工具。TR7700 SIII Ultra CI先進的防護塗層檢測功能，具有強化的光學設計和專業的多相位照明，可用於檢測塗層缺陷問題，不但能夠測量塗層厚度，更具有檢測助焊劑和膠的能力。

• 多應用保護塗層檢測解決方案
• 塗佈區域自動學習智能編程功能
• 雷射傳感器高精度塗層厚度測量*
• 業界領先高生產量及高速檢測
• 助焊劑和膠檢測能力
• 智慧工廠即時 SPC 趨勢追蹤

*選配項目

Optical System

Imaging Method	Dynamic Imaging
Top Camera	4 Mpix
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W+UV LED

Imaging Performance

Imaging Speed

@10 µm 2D: 60 cm²/sec
@15 µm 2D: 120 cm²/sec
@10 µm 2D+3D: 27 – 39 cm²/sec
@15 µm 2D+3D: 40 – 60 cm²/sec

Motion Table & Control

X-Y-Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	1 µm

Board Handling

Max PCB Size	500 x 460 mm
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg. Optional: 5 kg
Top Clearance	25 mm. Optional: 50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component Defects	Missing Tombstoning Billboarding, Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder Joint Defects	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch / Contamination
Conformal Coating	Missing Coating Insufficient Coating Crack Bubble Splash Contamination Spill Coating Thickness Glue Height (3D Laser)

Dimensions

WxDxH	1100 x 1720 x 1710 mm Note: not including signal tower, signal tower height 515 mm
Weight	940 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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