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INTRODUCTION
The TR7950Q SII Series is a highly modular Wafer Inspection and Micro Measurement Metrology platform that utilizes AI-driven algorithms to maximize production yields in advanced semiconductor manufacturing. This highly modular system features an optional SWIR (Short-Wave Infrared) module specifically designed to detect hidden inner cracks and subsurface defects that remain invisible to standard visible light sensors. Inspection & Metrology for: Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Wafer Thickness, Topology, Film Thin, through-silicon via (TSV).
*Optional
• High Resolution Wafer Inspection
• Precise Micro Measurements with Metrology Capabilities
• Ultra-High-Speed TSV & Thin-Film Metrology
• Inner Defect Detection with SWIR (Short-Wave Infrared) Module*
• 0.5/1 μm Resolution Available through DFF (Depth From Focus) Module*
• Cleanroom: Class 100 - ISO 5 Clean Room
• TSV measurement capabilities: Sensing TSV depth, Trench depth
• Thin Film measurement capabilities: Oxide, Nitride, PR, PI film thickness
*Optional
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Camera |
25 Mpix |
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Optical Resolution |
2.5 µm |
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Lighting |
Multi-phase True Color LED, Coaxial Lighting |
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3D Technology |
Quad Digital Fringe Projectors |
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Max. 3D Height |
600 μm |
Wafer and Frame Handling
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Wafer |
6", 8", 12" |
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Frame |
8", 12" |
Clean Room
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Clean Room Class |
ISO Class 5 (ISO 14644-1) |
Motion Table & Control
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X Axis Control |
Linear Motor with Motion Controller + Air Bearing or Linear Guide |
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Y Axis Control |
Linear Motor with Motion Controller + Air Bearing or Linear Guide |
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Z Axis Control |
Ball Screw + Linear Guide + AC Servo Motor with Motion Controller or
Linear Guide + Linear Motor with Motion Controller
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X-Y Axis Resolution |
0.1 µm |
Inspection and Metrology Functions
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Patterned Wafer |
Residues, Crack, Scratch, Particle, Pad Abnormal, Discolor, Contamination, Peeling, Probe Mark Defect, CD Measurement
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Bump Wafer |
2D Bump Size, 3D Bump Height, Bump Defect, Foreign Material,
CD Measurement
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Wafer Frame |
Chipping, Crack, Scratch, Particle, Contamination, CD Measurement,
Saw 3D metrology |
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Wafer Topology |
Wafer Thickness, Top-side Warpage |
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TSV |
Sensing TSV depth, Trench depth |
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Thin Film |
Oxide, Nitride, PR, PI film thickness |
Optional Features
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Sensing Technologies* |
3D DFF Module (0.55 or 1 μm), SWIR Module (1, 2 or 4 μm), CSS Module, TSV/Thin Film Module |
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TSV/ Thin Film Module |
Spot Size: 50μm, 25 μm. TSV aspect ratio: Max. 30:1. Via diameter: 3~20 μm.
Film thickness range: 100 nm ~ 30 μm
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Dimensions
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WxDxH |
1235 x 2590 x 2050 mm
Note: Dimensions change according to EFEM |
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Weight** |
2300 kg |
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* You may install either DFF or SWIR, and they are compatible with the TSV/Thin Film and CSS modules.
** Without EFEM Module
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Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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