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INTRODUCTION
TR7950Q SII 系列是一款具備高度模組化的晶圓檢測與細微量測計量平台，利用 AI 驅動演算法，在先進半導體製造中實現生產良率的最大化。這款高度模組化的系統配備了選配的 SWIR（短波紅外線）模組，專為偵測隱蔽的內部裂痕及次表面缺陷而設計，這些缺陷是標準可見光感測器所無法察覺的。 適用於檢測與計量：先進 WLP（晶圓級封裝）、晶圓框架、具圖案晶圓、晶圓凸塊、WLCSP（晶圓級晶片尺寸封裝）、晶圓厚度、表面形貌、薄膜、矽穿孔（TSV）。
• 高解析度晶圓檢測
• 具備計量功能的精確細微量測
• 超高速 TSV（矽穿孔）與薄膜計量檢測
• 利用 SWIR（短波紅外線）模組進行內部缺陷檢測*
• 透過 DFF（焦深量測）模組可提供 0.5 / 1 μm 的解析度*
• Class 100 - ISO 5 無塵環境
• TSV 量測能力：偵測 TSV 深度、溝槽深度
• 薄膜量測能力：氧化物、氮化物、光阻（PR）、聚醯亞胺（PI）薄膜厚度
*選配
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Camera |
25 Mpix |
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Optical Resolution |
2.5 µm |
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Lighting |
Multi-phase True Color LED, Coaxial Lighting |
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3D Technology |
Quad Digital Fringe Projectors |
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Max. 3D Height |
600 μm |
Wafer and Frame Handling
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Wafer |
6", 8", 12" |
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Frame |
8", 12" |
Clean Room
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Clean Room Class |
ISO Class 5 (ISO 14644-1) |
Motion Table & Control
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X Axis Control |
Linear Motor with Motion Controller + Air Bearing or Linear Guide |
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Y Axis Control |
Linear Motor with Motion Controller + Air Bearing or Linear Guide |
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Z Axis Control |
Ball Screw + Linear Guide + AC Servo Motor with Motion Controller or
Linear Guide + Linear Motor with Motion Controller
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X-Y Axis Resolution |
0.1 µm |
Inspection and Metrology Functions
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Patterned Wafer |
Residues, Crack, Scratch, Particle, Pad Abnormal, Discolor, Contamination, Peeling, Probe Mark Defect, CD Measurement
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Bump Wafer |
2D Bump Size, 3D Bump Height, Bump Defect, Foreign Material,
CD Measurement
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Wafer Frame |
Chipping, Crack, Scratch, Particle, Contamination, CD Measurement,
Saw 3D metrology |
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Wafer Topology |
Wafer Thickness, Top-side Warpage |
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TSV |
Sensing TSV depth, Trench depth |
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Thin Film |
Oxide, Nitride, PR, PI film thickness |
Optional Features
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Sensing Technologies* |
3D DFF Module (0.55 or 1 μm), SWIR Module (1, 2 or 4 μm), CSS Module, TSV/Thin Film Module |
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TSV/ Thin Film Module |
Spot Size: 50μm, 25 μm. TSV aspect ratio: Max. 30:1. Via diameter: 3~20 μm.
Film thickness range: 100 nm ~ 30 μm
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Dimensions
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WxDxH |
1235 x 2590 x 2050 mm
Note: Dimensions change according to EFEM |
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Weight** |
2300 kg |
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* You may install either DFF or SWIR, and they are compatible with the TSV/Thin Film and CSS modules.
** Without EFEM Module
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Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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