• 2.5 μm High-Resolution 3D SEMI Back-end AOI
• Precise Metrology-Grade Measurements*
• AI-powered Inspection with AI Smart Programming*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*
• Industry 4.0 Ready Platform
*Optional
Optical System
|
Imaging Method |
Stop-and-Go Imaging |
|
Top Camera |
12 Mpix / 21 Mpix / 25 Mpix |
|
Imaging Resolution |
2.5 µm / 5 µm / 5.5 µm / 7 µm / 8 µm |
|
Lighting |
Multi-phase True Color LED |
Imaging Performance
|
Max. Imaging Speed |
@2.5 µm: 3.5 cm²/sec (1)
@5 µm: 13 cm²/sec
@5.5 µm: 7.8 cm²/sec
@7 µm: 24 cm²/sec
@8 µm: 29 cm²/sec
* (1) Available for TR7700Q SII-S |
Motion Table & Control
|
X Axis Control |
Ballscrew + AC Servo with Motion Controller |
|
Y Axis Control |
Dual Driven Ball Screw + AC Servo Motor |
|
Z Axis Control |
Ballscrew + AC Servo with Motion Controller |
|
X-Y-Z Axis Resolution |
1 µm |
Board Handling
|
Max. PCB Size* |
TR7700Q SII-S: 510 x 460 mm, @2.5 μm: 285×150 mm
TR7700Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
* Larger PCB size requires additional memory. |
|
PCB Thickness |
0.6-5 mm |
|
Max. PCB Weight |
3 kg. Optional: 5kg |
|
Top Clearance |
TR7700Q SII-S: 20 mm
TR7700Q SII-S DL: 20 mm
21MP 8µm: Top Clearance: 50mm |
|
Bottom Clearance |
40 mm |
|
Edge Clearance |
3 mm. Optional: 4 mm / 5 mm |
|
Conveyor |
Inline Height: 880 – 920 mm
* SMEMA Compatible |
Inspection Functions
|
Component Defects |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective, Upside Down
Extra Component
Foreign Material
Lifted Component |
|
Solder Joint Defects |
Solder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger Scratch/ Contamination |
|
Die Bonding |
Missing
Orientation
Shift
Rotation
Chipping
Crack
Scratch
Foreign Material
Epoxy on Die
Epoxy Coverage
|
|
Wire Bonding
|
Broken
Short
Sweep/Sink
Missing
Sway
Collapse
Loop Height
Sagged Wire
Cross Wire Gap
Wire Tracing
Ball Bond Diameter
Ball Placement
Stitch Width
Stitch Coverage over Ball
Ball-off Pad
Ball touch Pad Distance
Clubbed Ball
Ball Thickness
Lifted Ball
Low Landing
Bond on Contamination
Foreign Material
|
|
Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
|
Dimensions
|
WxDxH |
TR7700Q SII-S: 1100 x 1720 x 1710 mm
TR7700Q SII-S DL: 1100 x 1820 x 1710 mm
Note: not including signal tower, signal tower height 515 mm |
|
Weight |
TR7700Q SII-S: 910 kg
TR7700Q SII-S DL: 960 kg |
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
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