產品介紹

光學測試設備

TR7900Q SII-R

INTRODUCTION

3D SEMI AOI TR7900Q SII-R 是半導體與先進封裝業的 3D 自動檢測複判站，完善整合裝載/卸載模組，以簡化基板和彈匣的輸送。 2.5 μm 高解析智能工廠解決方案TR7900Q SII-R可以檢測黏晶、球形接合、帶狀接合、楔形接合、銀膠、SiP、填充膠、SMD、凸塊和錫點，且能夠檢測高達15 μm (0.6 mil)的線徑。

• 打線接合與黏晶高級封裝缺陷檢測
• 複判識別標記模組
• 2.5 μm 量測等級*技術高解析度 3D AOI
• 內建彈匣裝載/卸載輸送裝置
• 打線檢測 AI演算法技術支持*
• 可檢測小至 15 μm 的金/鋁/銀/銅線
• 接合檢測：球形接合、楔形接合、帶狀接合
• 短波紅外 (SWIR) 照明檢測內部裂縫和碎裂*
• 無塵環境等級 100 - ISO 等級 5 (ISO 14644-1)

*選配項目

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	25 Mpix
Imaging Resolution	2.5 µm
Lighting	Multi-phase True Color LED
3D Technology	Quad Digital Fringe Projectors
Max. 3D Height Range	600 μm

Defect Marking Method

Marking Method

Ink Printer. Optional: Ink Pen

Motion Table & Control

X Axis Control	Linear Motor
Y Axis Control	Dual Linear Motor
X-Y Axis Resolution	0.1 µm

Board Handling

Max. Stack Magazine Qty.	3 Magazines (based on Magazine width 125 mm)
Magazine Dimension	Width: 50 - 175 mm Length: 120 - 320 mm Height: 80 - 160 mm
Strip Dimension	Width: 35 - 180 mm Length: 100 - 300 mm Thickness: 0.1 - 1.5 mm
Max. Strip Weight	0.4 kg
Strip Carrier / Fixing	Gripper Conveyor
Top Clearance	15 mm
Bottom Clearance	6 mm
Edge Clearance	3 mm

Inspection Functions

Die Bonding	Missing Orientation Rotation Shift Tilted Chipping Crack Scratch Foreign Material Bond line thickness Epoxy on Die Epoxy Coverage Epoxy Height
Wire Bonding	Broken Short Sweep/Sink Missing Sway Collapse Loop Height Sagged Wire Cross Wire Gap Wire Tracing Ball Bond Diameter Ball Placement Stitch Width Stitch Coverage over Ball Ball-off Pad Ball touch Pad Distance Clubbed Ball Ball Thickness Lifted Ball Low Landing Bond on Contamination Foreign Material
Bonding Area/Pad	Copper Protrusion Crack Chipping Exposed Copper Exposed Nickel Target Material Scratches or Brush Marks Oxidation Foreign Material

Dimensions

WxDxH	2370 x 1455 x 1700 mm Note: not including signal tower, signal tower height 515 mm
Weight	1120 kg. With Auto Load/Unload Module: 1280 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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