產品介紹

3D 錫膏印刷自動光學檢測機 (SPI)

TR7007 SII Ultra

INTRODUCTION

The TR7007 SII Ultra is the latest High Resolution 6 μm platform for SEMI Back-end Solder Inspection. The 3D SEMI SPI has metrology capabilities for solder measurements, such as solder gaps. The platform is also equipped with wide spectrum light to enhance contrast and increase defect detection rate. The TR7007 SII Ultra is an Industry 4.0 Ready Solution that supports closed loop feedback / feed-forward, the IPC-CFX, and the IPC Hermes 9852 standard.

Applications: Bumps, Flux, Glue, Solder Paste, Surface

• High-speed SEMI Back-end inspection, up to 74 cm²/sec
• Precise Solder Measurements with TRI SPI Metrology
• Wide Spectrum Light for Enhanced Contrast and Detection Rate
• Ready to Inspect in Minutes with TRI's Smart Programming
• Closed Loop Ready: Feedback and Feed-forward Capabilities
• Smart Factory solution with Real-time SPC Trends

Optical System

Imaging Method	Dynamic Scan
Top Camera	4 Mpix
Imaging Resolution	6 µm / 10 µm
Lighting	Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting

Imaging Performance

Max. Imaging Speed

6 μm: 25 cm2/sec ; 10 μm: 74 cm2/sec

Motion Table & Control

X-Axis Control	Linear motor + Linear Scale + EtherCAT Servo
Y-Z Axis Control	AC motor with ball screw + EtherCAT Servo
X-Y Axis Resolution	0.5 µm
Z Axis Resolution	1 µm

Board Handling

Max. PCB Size	TR7007 SII Ultra: 510 x 460 mm TR7007 SII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max. PCB Weight	3 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Applications	Bare Board Bumps Flux Mini-LED Solder Solder Paste
Defects Detected	Insufficient Paste Excessive Paste Shape Deformity Missing Paste Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SII Ultra: 1100 x 1480 x 1600 mm TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm Note: not including signal tower, signal tower height 512 mm
Weight	TR7007 SII Ultra: 740 kg TR7007 SII Ultra DL: 925 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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