產品介紹

半導體檢測機 (SEMI)

TR7720S

INTRODUCTION

TR7720S是一款專為半導體與封裝行業設計的小型AI驅動 AOI，可用於檢測打線接合、黏晶、SMD和錫點。5.5 μm高解析度解決方案TR7720S擁有先進測量技術和強化的機械結構，可提供精確和準確的檢測結果，能夠檢測高達50 μm（2mil）的線徑。

• 打線接合與黏晶高級封裝缺陷檢測
• 5.5 μm 高解析度小型 AOI
• 打線缺陷檢測人工智能檢測演算法*
• 提升數據可追溯性的量測等級*技術
• 可檢測小至 50 μm 的金/鋁/銀/銅線
• 接合檢測：球形接合、楔形接合、帶狀接合
• 智能工廠即時 SPC 趨勢追蹤

*選配項目

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Imaging Resolution	5.5 µm
Lighting	Multi-phase True Color LED, Coaxial Lighting

Imaging Performance

Max. Imaging Speed

10.3 cm²/sec

Motion Table & Control

X-Y-Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution	1 µm

Board Handling

Max. PCB Size	310 x 250 mm
PCB Thickness	0.1-5 mm
Max. PCB Weight	1 kg
Top Clearance	25 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Die Bonding	Missing Orientation Shift Rotation Chipping Crack Scratch Foreign Material Epoxy on Die Epoxy Coverage
Molding / Underfill Materials (EMC, CUF, NCP, NCF, MUF)	Area coverage Shapes/Dimensions Surface Void Damage Crack Scratches Delamination Contamination Surface particles
Bonding Area/Pad	Copper Protrusion Crack Chipping Exposed Copper Exposed Nickel Target Material Scratches or Brush Marks Oxidation Foreign Material

Dimensions

WxDxH	750 x 1460 x 1700 mm Note: not including signal tower, signal tower height 272.5 mm
Weight	710 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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