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INTRODUCTION
TR7600FB SII 是新一代 AXI，具備全新的 X 射線成像結構設計，提供更清晰的影像。這款智慧型 3D AXI 搭載 AI 檢測演算法、AI 氣泡檢測及編程技術。此 AXI 解決方案可檢測大型電路板，尺寸最大可達 850 mm x 520 mm，重量可達 12kg。TR7600FB SII 在不影響生產線產能的情況下，能有效降低漏測與誤報。
• 全新X 射線成像結構設計，提供更清晰的影像
• AI 檢測演算法、AI 氣泡檢測與編程
• 5 µm 高精度，實現全方位的缺陷檢測
• 新一代機械設計，速度更快，最高可達 20 FOV/s
• 支援多樣產品在線微調，無需中斷生產
• 大型電路板檢測，最大可達 850 mm x 520 mm，重量可達 12 kg
• 智慧工厂简易 MES 串接
• 應用領域：航太、先進封裝、車用電子、資料中心、工業物聯網（IIOT）、醫療及行動裝置
• 通訊標準：SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
40 -130 kV |
| Imaging Resolution |
5 μm - 30 μm |
| Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-precision ballscrew + AC-servo controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
850 x 520 mm |
| PCB Thickness |
0.4 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 30 μm: 60 mm
@ 25 μm: 80 mm
@ 20 μm: 90 mm
@ 15 μm: 90 mm
@ 10 μm: 90 mm
@ 5 μm: 90 mm |
| Bottom Clearance |
@ 30 μm: 50 mm
@ 25 μm: 50 mm
@ 20 μm: 50 mm
@ 15 μm: 40 mm
@ 10 μm: 20 mm
@ 5 μm: 10 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm. Optional: 940 - 965 mm |
Inspection Functions
| Capabilities |
BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, Paladin Connector, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs |
| Defects |
Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity, Rotation, Foreign Material, Insufficient/Excess Solder, Bridging, Open, Solder Ball, Non-Wetting, Void and Lifted Lead |
Dimensions
| WxDxH |
1550 x 2240 x 1800 mm
* not including signal tower, height: 519.5 mm |
| Weight |
3770 kg |
| Power Requirement |
200 – 240 VAC, Single Phase, 50 / 60 Hz, 4 kVA |
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