產品介紹

自動X射線檢測機 (AXI)

TR7600F2D QL

INTRODUCTION

TR7600F2D QL 搭載全新機械平台，專為大型電路板檢測設計，尺寸最大可達 2100 x 510 mm。提供 5 – 30 µm 的多重高解析度檢測。此AXI亦配備專用 2D 相機，支援汽車產業相關應用，如條碼讀取與基準點檢測。TR7600F2D QL 能可靠地檢測多種零件缺陷，包含 BGA、電容器、晶片、WLCSP、DIMM 連接器、Flip-Chips、Ground Pads 、Gullwing、散熱片、J-Leads、LED 芯片、LGA、Paladin 連接器、電阻、RNET、封裝體系（SiP）、SMT 連接器、SOIC、SOT、導熱片、QFN、QFP 以及THT。　

• 超大尺寸板邊檢測，最高可達 2100 x 510 mm
• 靈活的多解析度平台：5 – 30 µm
• 生產不中斷的在線微調功能
• AI 驅動檢測演算法，實現精準缺陷檢測
• 配備 2D 相機，適用於汽車產業的條碼讀取、基準點檢測及光板標記
• 支援智慧工厂，可轻松串接 MES
• 應用領域：伺服器板、LED 燈板、汽車電子控制單元 (ECU) 等

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera	Flat Panel Detector
X-ray Source	60 - 130 kV
Imaging Resolution	5 μm - 25 μm
Inspection Method	2D

Motion Table & Control

X-Axis Control	High-Precision Ballscrew + AC-Servo Controller
Y-Axis Control	High-Precision Ballscrew + AC-Servo Controller
Z-Axis Control	High-Precision Ballscrew + AC-Servo Controller
X-Y Axis Resolution	N/A

Board Handling

Max PCB Size	2100 x 510 mm
PCB Thickness	0.6 - 7 mm
Max PCB Weight	12 kg
Top Clearance	@ 20/25 μm: 50 mm @ 15 μm: 40 mm @ 10 μm: 25 mm @ 5 μm: 3 mm
Bottom Clearance	70 mm
Edge Clearance	3 mm or 5 mm
Conveyor Height	880 - 920 mm * SMEMA Compatible

Inspection Functions

Capabilities	BGAs Capacitors Chips Ground Pads Gullwing Resistor RNET SMT Connectors SOIC SOT Thermal Pad QFNs QFP
Defects	Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Insufficient/Excess Solder Bridging Solder Ball Void

Dimensions

WxDxH	3600 x 2000 x 1940 mm Note: not including signal tower, height: 520 mm
Weight	5800 kg
Power Requirement	200 – 240 VLL , Three phase 4 W, 50 / 60Hz, 7.0 kVA

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