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INTRODUCTION
2.5D 在線型 AXI TR7600F2D Plus 採用全新的機械平台以實現更快的週期時間（Cycle Time），效能較前代機型提升了 10%。憑藉 5 µm 的高解析度，TR7600F2D Plus 提供了全面的檢測覆蓋率，非常適合消費性電子產業（例如行動電子製造）的檢測需求。
TR7600F2D Plus 能夠可靠地檢測 BGA、電容器、晶片、WLCSP、DIMM 連接器、Flip-Chips、Ground Pads、Gullwing、散熱片、J-Leads、LED 晶片、LGA、Paladin 連接器、電阻、RNET、封裝體系（SiP）、SMT 連接器、SOIC、SOT、導熱片、QFN、QFP 以及THT中的缺陷。
• Next Generation Mechanical Design for Faster Cycle Time
• Flexible Multi-Resolution, Multi-Power in one Configuration
• New motion controller, for real-time measurements and ease of maintenance
• Improved 2D Camera for easier adjustments and less calibration
• Large Board Inspection, up to 900 mm x 520 mm
• Smart Factory Ready with MES Connectivity
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
60 -130 kV |
| Imaging Resolution |
5 μm - 30 μm |
| Inspection Method |
2D, 2.5D |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-precision ballscrew + AC-servo controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
900 x 520 mm |
| PCB Thickness |
0.5 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 15/20/25/30 μm: 50 mm
@ 10 μm: 30 mm
@ 5 μm: 10 mm
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| Bottom Clearance |
50 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm
* SMEMA Compatible
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Inspection Functions
| Capabilities |
BGAs
Capacitors
Chips
WLCSP
DIMM Connectors
Flip-Chips
Ground Pads
Gullwing
Heat sinks
J-Leads
LED Chips
LGAs
Paladin Connector
Resistor
RNET
SiP
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP
THTs |
| Defects |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Void |
Dimensions
| WxDxH |
1537 x 2160 x 1800 mm
Note: not including signal tower, height: 519.5 mm
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| Weight |
3150 kg |
| Power Requirement |
200 – 240 VAC, single phase, 50/60 Hz, 4 kVA |
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