INTRODUCTION
新一代的在線型ICT+FCT解決方案擁有突破性的優越表現，多核心平行測試功能具多達四個獨立的核心，能夠大幅提升測試產能。可相容SMEMA的在線型處理器，降低了操作員的工作量並且提升了工作效能，並且具有長生命週期的快速插拔治具，結合內建自我診斷系統及支援自動校驗功能，能夠確保長期的測試可靠度。
• 新一代高彈性多核心平行測試
Tester Specifications
Analog/hybrid test points
TR5001Q(L) SII INLINE: 4,096
Operating System
Microsoft® Windows compatible PC with USB, Windows 10
Fixture Type
Inline with long lifespan Quick Disconnection Interface
Standard Testing Components
Analog Test Hardware
6-wire measurement switching matrix
Programmable AC/DC/DC High voltage and current sources
AC/DC voltage, DC current measurement
Component R/L/C measurement
Optional Components
Analog Hardware
TestJet vectorless open circuit detection
Arbitrary Waveform Generator
Digital Testing
Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
Serial Test Controller (STC) Programming
DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
DPS Programmable DUT Power supply :(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
Yield Management System
YMS 4.0
Board Handling
Min. PCB Size
50 x 50 mm
Max. PCB Size
510 x 510 mm
PCB Thickness
0.6 - 5 mm
Dimensions
WxDxH
TR5001(D/Q) SII INLINE: 900 x 1080 x 1660 mm
TR5001(D/Q)L SII INLINE: 1000 x 1230 x1676 mm
Note: not including signal tower,signal tower height: 390 mm
Weight
TR5001(D/Q) SII INLINE: 670 kg
TR5001(D/Q)L SII INLINE: 720 kg
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement
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