INTRODUCTION
TR7700Q 3D AOI 擁有數位四向條紋光投影技術,結合最新穎的2D+3D 檢測技術,為組裝電路板檢測領域掀起全新革命。全方位3D數位條紋光技術涵蓋檢測範圍廣闊,擁有極佳的精準性呈現極小共面缺陷及焊點問題。 TRI的3D錫點及爬錫檢測符合IPC標準,確保爬錫的品質。藉由檢查爬錫高度及體積,TR7700Q 3D AOI可檢測出少錫、缺錫、空焊等不良現象。
• 超高精准度 2D+3D AOI 走停式取像
• 爬錫高度及體積檢測功能
• 清晰且可靠的3D四光源數位條紋光
• 可變頻3D檢測範圍高度高達 30 mm
• 免空壓智慧化自動運輸送帶系統(IACS)
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Stop-and-Go Imaging
Top Camera
4 Mpix or 12 Mpix (factory setting)
Angle Camera
N/A
Imaging Resolution
5.5 µm, 10 µm, 15 µm (factory setting)
Lighting
Multi-phase True Color LED
3D Technology
Quad Digital Fringe Projectors
Max. 3D Range
4 Mpix@ 15 µm: 0-30 mm* 12 Mpix@ 5.5 µm: 0-4 mm 12 Mpix@ 10 µm: 0-30 mm* *Need GPU card upgrade
Inspection Performance
Imaging Speed
4 Mpix@ 15 µm: 21 cm²/sec 12 Mpix@ 5.5 µm: 4.3 cm²/sec (2D only: 12.2 cm²/sec) 12 Mpix@ 10 µm: 14.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress Note: Depending on component distribution
Motion Table & Control
X-Axis Control
Ballscrew + AC-servo controller
Y-Axis Control
Ballscrew + AC-servo controller
Z-Axis Control
Ballscrew + AC-servo controller
X-Y Axis Resolution
1 μm
Board Handling
Max PCB Size
TR7700QI @ 5.5 µm: 330 x 330 mm* TR7700QI @ 10 µm, 15 µm: 510 x 460 mm TR7700QI DL @ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane *Depending on component distribution, the vailable PCB size could be different
PCB Thickness
0.6-5 mm
Max PCB Weight
3 kg
Top Clearance
5.5 µm: 25 mm 10 µm: 50 mm 15 µm: 40 mm
Bottom Clearance
40 mm [100 mm optional]
Edge Clearance
3 mm [5 mm optional]
Conveyor
Inline Height: 880 – 920 mm * SMEMA Compatible
Inspection Functions
Component
Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder
Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination
Dimensions
WxDxH
TR7700Q: 1000 x 1400 x 1650 mm TR7700Q DL: 1000 x 15000 x 1650 mm Note: not including signal tower, signal tower height 520 mm
Weight
TR7700Q: 650 kg TR7700Q DL: 685 kg
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement