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TR7700L SIII Plus
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TR7700L SIII Plus
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INTRODUCTION
TR7700L SIII Plus 結合了先進的高精度相機系統和TRI獨有的多相位光源，可捕捉到全尺寸PCB板前所未有的細緻影像。新一代檢測軟件結合了優秀的缺陷檢測和簡易型自動CAD程式編寫，為AOI檢測解決方案提供當代最頂尖的技術水準。
• 備有多相位光源的高精準度AOI
• 全新圖形使用者界面提供簡易離線程式編寫
• 智能化自動輸送帶系統大幅度降低加載時間
• 新式色彩空間演算法，可提高正確度並減少誤判
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Dynamic Imaging |
| Top Camera |
4 or 12 Mpix high speed color camera |
| Angle Camera |
N/A |
| Imaging Resolution |
5.5 µm, 10 µm (factory setting)
Note: 4 MP camera configuration supports 10 μm, 12 MP configuration supports 5.5 μm. |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
Single/Dual 3D laser sensors (Optional) |
| Max. 3D Range |
@5.5 μm: 2 mm
@10 μm: 4 mm
Note: Depending on board size, layout, laser type and/or laser module settings |
Inspection Performance
| Imaging Speed |
@5.5 μm 2D: 24 cm²/sec
@10 µm 2D: 60 cm²/sec
@5.5 µm 2D+3D (optional): 4 – 10 cm²/s
@10 µm 2D+3D (optional): 27 – 39 cm²/sec
Note: Depending on board size, layout, laser type and/or laser module settings |
Motion Table & Control
| X-Axis Control |
Ballscrew + AC-servo controller |
| Y-Axis Control |
Ballscrew + AC-servo controller |
| Z-Axis Control |
N/A |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
765 x 610 mm |
| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
3 kg. Optional: 5 / 12 kg |
| Top Clearance |
25 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm. [4 / 5 mm optional] |
| Conveyor |
Inline
Height: 880 – 920 mm
* SMEMA Compatible
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Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
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| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
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Dimensions
| WxDxH |
1365 x 1720 x 1710 mm
Note: not including signal tower, signal tower height 520 mm
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| Weight |
1005 kg
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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