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INTRODUCTION
TR8100 SII 系列是最新型的高階電路板測試ICT，擁有數位無 MUX 架構 1:1 針點與檢測點比例設計，可測試多達11,088個針點數。高程式設計性可以進行快速程式開發，工程變更修改更快速更簡易；不佔空間、高產量、高精度測試的特性，能有效率測試大針點數且複雜的低電壓測試電路板(PCBA)，提高系統穩定度、長期的測試可靠度及故障覆蓋率，以得到降低成本的目的，並能夠將測試結果資料完整呈現。
• 真空治具高故障覆蓋率測試解決方案
• 低電壓裝置測試與高速測試
• 內建自我診斷功能
• 高精度測量和測試
• 友善的操作介面，輕鬆的程序開發
Tester Specifications
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Max. Test Points |
TR8100 SII: 3584
TR8100H SII: 7056
TR8100HL SII: 11088
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Operating System |
Microsoft® Windows compatible PC, Windows 10 |
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Fixture Type |
Vacuum type |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Synthesized Arbitrary Waveform Generator
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TestJet vectorless open circuit detection
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@5 A, 3.3 V@5 A, 12 V@5A, 0.2~20 V@3 A and -3~-20 V@3 A
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On-board Flash, EEPROM, MAC programming
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Optional Components
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Analog Hardware |
Fixture Conversion Kits for Teradyne, GenRad |
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Digital Testing |
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APPS Power Supplies: Programmable 75 V/8 A/200 W Max., 1 Channel
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Serial Test Controller (STC) Programming
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DPS Programmable DUT Power supply:
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
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ToggleScan Test
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Yield Management System |
YMS 4.0 |
Dimensions
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WxDxH |
TR8100 SII: 1150 x 850 x 800 mm
TR8100H SII: 1150 x 850 x 800 mm
TR8100HL SII: 1400 x 850 x 800 mm |
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Weight |
TR8100 SII: 400 kg
TR8100H SII: 400 kg
TR8100HL SII: 470 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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