Semiconductor Inspection (SEMI)
INTRODUCTION
The TR7700Q SII-S is the next-generation AI-powered Inspection platform for the Semiconductor & Advanced Packaging Industry. The 3D SEMI AOI is enhanced with metrology capabilities and multiple imaging technologies to achieve full coverage inspection. The 2.5 μm High Resolution platform solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Inspection for: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints.
• 2.5 μm High-Resolution 3D SEMI Back-end AOI
Optical System
Imaging Method
Stop-and-Go Imaging
Top Camera
12 Mpix / 21 Mpix / 25 Mpix
Imaging Resolution
2.5 µm / 5 µm / 5.5 µm / 8 µm
Lighting
Multi-phase True Color LED
Imaging Performance
Max. Imaging Speed
@2.5 µm: 3.5 cm²/sec (2)
Motion Table & Control
X Axis Control
Ballscrew + AC Servo with Motion Controller
Y Axis Control
Dual Driven Ball Screw + AC Servo Motor
Z Axis Control
Ballscrew + AC Servo with Motion Controller
X-Y-Z Axis Resolution
1 µm
Board Handling
Max. PCB Size
TR7700Q SII-S: 510 x 460 mm, @ 2.5 μm: 285×150 mm * TR7700Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness
0.6-5 mm
Max. PCB Weight
TR7700Q SII-S: 3 kg. Optional: 5kg TR7700LQ SII-S: 3 kg. Optional: 5 kg / 12 kg
Top Clearance
TR7700Q SII-S: 20 mm TR7700Q SII-S DL: 50 mm
Bottom Clearance
40
Edge Clearance
3 mm. Optional: 4 mm / 5 mm
Conveyor
Inline Height: 880 – 920 mm
Inspection Functions
Component Defects
Missing
Solder Joint Defects
Solder Fillet Height
Die Bonding
Missing
Foreign Material
Wire Bonding
Broken
Bonding Area/Pad
Copper Protrusion
Scratches or Brush Marks
Dimensions
WxDxH
TR7700Q SII-S: 1100 x 1720 x 1710 mm TR7700Q SII-S DL: 1100 x 1820 x 1710 mm Note: not including signal tower, signal tower height 515 mm
Weight
TR7700Q SII-S: 910 kgTR7700LQ SII-S: 1025 kg
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement
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