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TR7700 SIII Plus
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TR7700 SIII Plus
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INTRODUCTION
TR7700 SIII Plusは、フルスピードで正確なマルチフェイズ検査を実現する最新世代のTRIのAOIソリューションです。 TR7700 SIII Plusは、超高速カメラ、インテリジェントオートコンベア、新しいGUIを組み合わせることで、高速プログラミング、最適化された基板搬送、生産ラインの統合、オフラインプログラミングのサポートを備えたパワフルで使いやすいAOIソリューションを提供します。 TRIの新カラーアルゴリズムとマルチ照明フェーズを組み合わせることで、不良カバレッジが向上し、最小限の虚報で非常に正確な検査結果を提供できます。
• 高精度フルスピードマルチフェーズAOI
• オフライン編集で簡単にプログラミングできる新しいGUI
• 搬送時間を短縮するインテリジェントオートコンベア
• 高精度を実現し、虚報を最小限に抑える新カラーアルゴリズム
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
Dynamic Imaging |
Top Camera |
4 or 9 or 12 Mpix high speed color camera |
Angle Camera |
N/A |
Imaging Resolution |
5.5 µm, 6 µm, 10 µm, 15 µm (factory setting)
Note: 4 MP camera configuration supports 10/15 μm, 9 MP configuration supports 10 μm, 12 MP configuration supports 6 μm. |
Lighting |
Multi-phase RGB+W LED |
3D Technology |
Single/Dual 3D laser sensors (optional) |
Max. 3D Range |
@5.5 μm: 2 mm @6 μm: 2 mm @10 μm: 4 mm @15 μm: 20 mm
Note: Depending on board size, layout, laser type and/or laser module settings |
Inspection Performance
Imaging Speed |
@5.5 μm 2D: 24 cm²/sec @6 µm 2D: 30 cm²/sec @10 µm 2D: 60 cm²/sec @15 µm 2D: 120 cm²/sec
@5.5 µm 2D+3D (optional): 4 – 10 cm²/s @6 µm 2D+3D (optional): 4 – 10 cm²/sec @10 µm 2D+3D (optional): 27 – 39 cm²/sec @15 µm 2D+3D (optional): 40 – 60 cm²/sec
Note: Depending on board size, layout, laser type and/or laser module settings
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Motion Table & Control
X-Axis Control |
Ballscrew + AC-servo controller |
Y-Axis Control |
Ballscrew + AC-servo controller |
Z-Axis Control |
N/A |
X-Y Axis Resolution |
1 µm |
Board Handling
Max PCB Size |
TR7700 SIII Plus: 510 x 460 mm TR7700L SIII: 660 x 610 mm TR7700L SIII Plus: 765 x 610 mm TR7700 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
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PCB Thickness |
0.6-5 mm |
Max PCB Weight |
TR7700 SIII Plus: 3 kg TR7700L SIII: 5 kg TR7700L SIII Plus: 3 kg. Optional: 5 / 12 kg TR7700 SIII DL: 3 kg
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Top Clearance |
25 mm |
Bottom Clearance |
40 mm |
Edge Clearance |
TR7700 SIII Plus: 3 mm [5 mm optional] TR7700L SIII: 5 mm TR7700L SIII Plus: 3 mm. [4 / 5 mm optional] TR7700 SIII DL: 3 mm [5 mm optional] |
Conveyor |
Inline Height: 880 – 920 mm
* SMEMA Compatible
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Inspection Functions
Component |
Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material
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Solder |
Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination
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Dimensions
WxDxH |
TR7700 SIII Plus: 1100 x 1670 x 1550 mm TR7700L SIII: 1300 x 1635 x 1655 mm TR7700L SIII Plus: 1365 x 1720 x 1710 mm TR7700 SIII DL: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
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Weight |
TR7700 SIII Plus: 1080 kg TR7700L SIII: 1240 kg TR7700L SIII Plus: 1005 kg TR7700 SIII DL: 1150 kg
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Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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