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INTRODUCTION
TR7600F3D LL SII は、CT機能を搭載した最新の高速3D AXIで、最大1000×660mmの大型基板サイズの検査に対応しています。TR7600F3D LL SII は、生産ラインのサイクルタイムを犠牲にすることなく、見逃しや誤報を低減します。 "
• 最大1000×660mmの大型基板検査用スマート3D AXIソリューション
• 最小5 µmの解像度で包括的な欠陥検出を実現
• 次世代のメカニカルデザインで20FOV/sまでの高速化を実現
• MESとの接続が容易なIndustry 4.0ソリューション
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
Flat Panel Detector |
X-ray Source |
130 kV Max (User Adjustable) |
Imaging Resolution |
5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm |
Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
X-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
Y-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
Z-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
X-Y Axis Resolution |
N/A |
Board Handling
Max PCB Size |
1000 x 660 mm*
* The Max. PCB Size will vary depending on the angle of incidence |
PCB Thickness |
0.4 - 7 mm |
Max PCB Weight |
12 kg |
Top Clearance |
@ 20/25/30 μm: 50 mm @ 15 μm: 45 mm @ 10 μm: 25 mm @ 5 μm: 5 mm |
Bottom Clearance |
@ 30 μm: 55 mm @ 5/10/15/20/25 μm: 70 mm |
Edge Clearance |
3 mm or 5 mm |
Conveyor Height |
880 - 920 mm
* SMEMA Compatible |
Inspection Functions
Capabilities |
Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Defects |
Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
Dimensions
WxDxH |
1730 x 2300 x 1975 mm
Note: not including signal tower, height: 502 mm |
Weight |
4850 kg |
Power Requirement |
200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
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