INTRODUCTION
次世代並列処理式インラインICT+FCTソルーションは、独立した4コアの漸進的なマルチコア平行検査を提供、検査能力を大幅に向上します。SMEMA対応のインライン搬入が作業者の作業負荷を軽減、作業効率を向上、耐久性に優れたクイックディスコネクト端子をもち、自動校正および自己診断機能を内蔵、長期にわたる検査の信頼性を確保します。
• 次世代フレキシブルマルチコア平行処理式テスター
• 任意のピンに8ポート連結可能な最先端技術のテストコントローラ
• 限られたアクセスへのソルーションおよびPXIモジュールを使用した機能検査の拡張性
• 自己診断機能及び自動校正機能を内蔵
• 高精度測定及び検査
• SMEMA対応のインライン高検出率テストソルーション
• 直観的でフロー方式の簡易なプログラミングインターフェイス
Tester Specifications
Analog/hybrid test points
TR5001Q(L) SII INLINE: 4,096
TR5001D(L) SII INLINE: 3,328 Optional: 4,096
TR5001(L) SII INLINE: 3,456 Optional: 4,480
Operating System
Microsoft® Windows compatible PC with USB, Windows 10
Fixture Type
Inline with long lifespan Quick Disconnection Interface
Standard Testing Components
Analog Test Hardware
6-wire measurement switching matrix
Programmable AC/DC/DC High voltage and current sources
AC/DC voltage, DC current measurement
Component R/L/C measurement
Optional Components
Analog Hardware
TestJet vectorless open circuit detection
Arbitrary Waveform Generator
Digital Testing
Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
Serial Test Controller (STC) Programming
DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
Yield Management System
YMS 4.0
Board Handling
Min. PCB Size
50 x 50 mm
Max. PCB Size
510 x 510 mm
PCB Thickness
0.6 - 5 mm
Dimensions
WxDxH
TR5001(D/Q) SII INLINE: 900 x 1080 x 1660 mm
TR5001(D/Q)L SII INLINE: 1000 x 1230 x1676 mm
Note: not including signal tower,signal tower height: 390 mm
Weight
TR5001(D/Q) SII INLINE: 670 kg
TR5001(D/Q)L SII INLINE: 720 kg
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement