|
|
TR5001 INLINE
 |
|
|
|
TR5001 INLINE
|
|
|
INTRODUCTION
インライン用最適化、SMEMA規格準拠ICT。基板アセンブリテスト用に拡張可能なプラットフォームとして 設計されました。より多くのお客様の要件を満たす経済的でカスタマイズ可能なソリューションを提供します。 また、本装置は選択可能なMDA機能とICT機能が組み合わさっており、生産ラインのコスト削減、テスト時間 削減に大きく貢献します。
• MDAからICTにアップグレードできるモジュラー式アップグレードオプション
• SMEMA規格準拠、高故障率検出、インラインテストソリューション
• PXIモジュールを用いた拡張機能
• 簡単迅速プログラミングユーザーインタフェース
Tester Specifications
|
Analog/hybrid test points |
3200 analog or maximum digital test points: 1600 |
|
Operating System |
Microsoft® Windows 10 |
|
Fixture Type |
Inline with long lifespan Quick Disconnection Interface |
Standard Testing Components
|
Analog Test Hardware |
-
6-wire measurement switching matrix
-
Measures voltage, current and frequency
-
Component R/L/C/D measurement
-
60 V high voltage current source for LED strip testing
|
Optional Components
|
Analog Hardware |
-
TestJet vectorless open circuit detection
-
Arbitrary Waveform Generator
|
|
Digital Testing |
-
Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
-
DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
-
Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
-
Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
-
On-board Flash, EEPROM, MAC programming
|
|
Yield Management System |
YMS 4.0 |
Board Handling
|
Min PCB Size |
70 x 70 mm |
|
Max PCB Size |
450 x 300 mm |
|
PCB Thickness |
0.6 - 5 mm |
Dimensions
|
WxDxH |
900 x 900 x 1645 mm
Note: not including signal tower, height: 515 mm |
|
Weight |
500 kg |
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
検索
メンバー エリア
