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TR7600F2D
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TR7600F2D
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INTRODUCTION
単相PCBおよびFPCBアセンブリ用に開発した高性能インライン2.5D-AXI、モバイル電子機器などの検査 に理想的です。微小空洞、0402はんだ不良、その他多くのQFNやBGAのはんだに関する問題を正確に 検出します。完全自動化プログラミングと多重プログラミングを組み合わせ、あらゆる生産ラインの生産効率 を最大限に引き上げます。
• 最大 900mm x 460 mmの大型ボード対応、高精度解像度検査
• エンジニアの作業時間を軽減、自動プログラミング
• 優れた画像品質を実現、マルチ分解能ブロックスキャンプログラムと高速処理
• シャドーフリー検査を実現する2Dおよび軸外画像取得
• 最大 130kV/300μAまで出力調整可能なX線チューブ
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
High resolution flat panel camera |
| X-ray Source |
Microfocus tube 130 kV max (user adjustable) |
| Imaging Resolution |
5 μm, 10 μm, 15 μm (factory setting) |
| Inspection Method |
2D, 2.5D, Planar CT (optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-precision ballscrew + AC-servo controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
900 x 460 mm |
| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
3 kg [8 kg optional] |
| Top Clearance |
@ 15 μm: 30 mm
@ 10 μm: 20 mm
@ 5 μm: 10 mm
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| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm |
| Conveyor Height |
880 - 920 mm
* SMEMA Compatible
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Inspection Functions
| Capabilities |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Floating
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| Defects |
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Non-wetting
Void
Lifted Lead
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Dimensions
| WxDxH |
1500 x 2060 x 1650 mm
Note: not including signal tower, height: 515 mm
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| Weight |
3250 kg |
| Power Requirement |
200 – 240 VAC single phase, 50/60 Hz, 4 kVA |
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