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TR7700 SII Plus
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TR7700 SII Plus
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INTRODUCTION
世界初のハイブリッドAOI：新しいハイブリッド検査デザインを採用したTR7700 SII Plusは、Stop & Go検査とダイナミックイメージングの両方を活用して、すべてのタイプのPCBAで最適な検査性能を実現できます（例：検査サイクル時間の短縮）。 検査モードを切り替えるだけで、製品に最適なアプローチを決定できます。
• Stop & Goまたはダイナミックイメージング切り替えのフレキシブルAOI
• インテリジェントイージープログラミングインターフェイス
• インテリジェントオートコンベアによる迅速な切り替え
• 異物および余分な部品の検査
• 6 µmまたは10 µmまたは15 µmの分解能
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Dynamic Imaging or Stop-and-Go on select configurations |
| Top Camera |
4 or 9 or 12 Mpix high speed color camera (factory setting) |
| Angle Camera |
N/A |
| Imaging Resolution |
6 µm, 10 µm, 15 µm (factory setting) |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
N/A |
| Max. 3D Range |
N/A |
Inspection Performance
| Imaging Speed |
4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec
4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec
9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec
12 Mpix@ 6 µm Dynamic Imaging: 40 cm²/sec
4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec
4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec
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Motion Table & Control
| X-Axis Control |
Ballscrew + AC-servo controller |
| Y-Axis Control |
Ballscrew + AC-servo controller |
| Z-Axis Control |
N/A |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm
TR7700 SII Plus@ 6 µm: 400 x 400 mm
TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane
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| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
3 kg |
| Top Clearance |
10 µm, 15 µm: 25 mm [48 mm optional◎※]
6 µm: 25 mm
◎The air blow module does not apply to this option
※This option is only available for 4 Mpix camera.
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| Bottom Clearance |
10 µm, 15 µm: 40 mm [100 mm optional]
6 µm: 40 mm
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| Edge Clearance |
3 mm [5 mm optional] |
| Conveyor |
Inline
Height: 880 – 920 mm
* SMEMA Compatible
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Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
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| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
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Dimensions
| WxDxH |
TR7700 SII Plus: 1000 x 1400 x 1650 mm
TR7700 SII Plus DL: 1000 x 1500 x 1650 mm
Note: not including signal tower, signal tower height 520 mm
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| Weight |
TR7700 SII Plus: 600 kg
TR7700 SII Plus DL: 650 kg
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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