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TR8100LV
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TR8100LV
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INTRODUCTION
大型で複雑なPCBアセンブリテスト用に設計されたTR8100LVは、低電圧テストを得意としたICTです。 真空接続システムで全てのピンの接触を確実なものにし、最大3584ピンまでのデジタルMUX設定を 可能にしました。より、ピン数が多いデバイスに対して迅速かつシンプルなテストと簡易プログラミング を実現します。テストアクセスが制限されている基板には、※TRI ToggleScan＆VregTest技術が解決します。 ※「TRI ToggleScan」& 「VregTest」はTest Reseach, Incの登録商標です。
• ピンアーキテクチャ毎デジタル1:1ドライバ／レシーバアーキテクチャ設計
• 真空フィクスチャによる高故障検出率テストソリューション
• 低電圧デバイステスト、高速試験
• 簡単迅速プログラミングユーザーインタフェース
Tester Specifications
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Analog/hybrid test points |
TR8100LV: 3584
TR8100LLV: 5632 |
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Operating System |
Microsoft® Windows compatible PC, Windows 10 |
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Fixture Type |
Offline press or vacuum type fixture |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Synthesized Arbitrary Waveform Generator
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TestJet vectorless open circuit detection
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@5 A, 3.3 V@5 A, 12 V@5A, 0.2~20 V@3 A and -3~-20 V@3 A
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On-board Flash, EEPROM, MAC programming
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Optional Components
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Analog Hardware |
Fixture Conversion Kits for Teradyne, GenRad |
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Digital Testing |
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Programmable DUT power supplies: 75 V / 8 A, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Yield Management System |
YMS 4.0 |
Dimensions
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WxDxH |
TR8100LV: 1150 x 850 x 800 mm
TR8100LLV: 1550 x 850 x 800 mm |
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Weight |
TR8100LV: 390 kg
TR8100LLV: 450 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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